Disclosed is an image sensor including: a center pixel group including 2x2 pixels having different colors in a center area of a 6x6 unit pixel group; and first to fourth color pixel groups having the same color as one pixel of the center pixel group, disposed as units of 2x4 pixels or 4x2 pixels to have a shape surrounding the center pixel group, and having different colors.

Disclosed is an image sensor including: a center pixel group including 2x2 pixels having different colors in a center area of a 6x6 unit pixel group; and first to fourth color pixel groups having the same color as one pixel of the center pixel group, disposed as units of 2x4 pixels or 4x2 pixels to have a shape surrounding the center pixel group, and having different colors.

A backside-illuminated image sensor includes arrayed photodiodes separated by isolation structures, and interlayer dielectric between first layer of metal interconnect and substrate. The image sensor has barrier metal walls in the interlayer dielectric between isolation structures and first layer interconnect, the barrier metal walls aligned with the isolation structures and disposed between the isolation structures and first layer interconnect. The barrier metal wall deflects light passing through photodiodes of the sensor that would otherwise be reflected by interconnect into different photodiodes. The sensor is formed by providing a partially fabricated semiconductor substrate with photodiodes and source-drain regions formed; forming gate electrodes on a frontside surface of the semiconductor substrate, depositing an etch-stop layer over the gate electrodes; depositing interlayer dielectric on the etch-stop layer; forming trenches extending to the etch-stop layer through the interlayer dielectric, the trenches being between photodiodes; and filling trenches with metal to form barrier metal walls.

A backside-illuminated image sensor includes arrayed photodiodes separated by isolation structures, and interlayer dielectric between first layer of metal interconnect and substrate. The image sensor has barrier metal walls in the interlayer dielectric between isolation structures and first layer interconnect, the barrier metal walls aligned with the isolation structures and disposed between the isolation structures and first layer interconnect. The barrier metal wall deflects light passing through photodiodes of the sensor that would otherwise be reflected by interconnect into different photodiodes. The sensor is formed by providing a partially fabricated semiconductor substrate with photodiodes and source-drain regions formed; forming gate electrodes on a frontside surface of the semiconductor substrate, depositing an etch-stop layer over the gate electrodes; depositing interlayer dielectric on the etch-stop layer; forming trenches extending to the etch-stop layer through the interlayer dielectric, the trenches being between photodiodes; and filling trenches with metal to form barrier metal walls.

An image sensor includes a pixel array that includes a first pixel group located in a first row and including a first select transistor and a first floating diffusion region, a second pixel group located in a second row and including a second select transistor and a second floating diffusion region, and a column line connected to both the first pixel group and the second pixel group. While charges generated by a photoelectric conversion element of the first pixel group are transferred to the first floating diffusion region, the first select transistor is turned off, the second select transistor is turned on, and a first voltage is applied to the column line through the second select transistor. A photoelectric conversion element of the second pixel group generates charges prior to the photoelectric conversion element of the first pixel group, so as to be transferred to the second floating diffusion region.

An image sensor includes a pixel array that includes a first pixel group located in a first row and including a first select transistor and a first floating diffusion region, a second pixel group located in a second row and including a second select transistor and a second floating diffusion region, and a column line connected to both the first pixel group and the second pixel group. While charges generated by a photoelectric conversion element of the first pixel group are transferred to the first floating diffusion region, the first select transistor is turned off, the second select transistor is turned on, and a first voltage is applied to the column line through the second select transistor. A photoelectric conversion element of the second pixel group generates charges prior to the photoelectric conversion element of the first pixel group, so as to be transferred to the second floating diffusion region.

A photoelectric conversion device includes a pixel, the pixel including an avalanche photodiode, and a signal processing circuit including a counter configured to generate a count value based on a photon incident on the avalanche photodiode during a count period, the signal processing circuit being configured to output the count value for each count period repeatedly. The pixel transitions from a first state to a second state in which a length of the count period is shorter than that in the first state in accordance with a result of determination based on the count value and a predetermined threshold value.

An image sensor includes: a first readout circuit that reads out a first signal, being generated by an electric charge resulting from a photoelectric conversion, to a first signal line; a first holding circuit that holds a voltage based on an electric current from a power supply circuit; and a first electric current source that supplies the first signal line with an electric current generated by the voltage held in the first holding circuit, wherein: the first holding circuit holds the voltage based on the electric current from the power supply circuit when the first signal is not read out to the first signal line by the first readout circuit.

An image sensor includes: a first readout circuit that reads out a first signal, being generated by an electric charge resulting from a photoelectric conversion, to a first signal line; a first holding circuit that holds a voltage based on an electric current from a power supply circuit; and a first electric current source that supplies the first signal line with an electric current generated by the voltage held in the first holding circuit, wherein: the first holding circuit holds the voltage based on the electric current from the power supply circuit when the first signal is not read out to the first signal line by the first readout circuit.

A detection device includes a sensor area in which a plurality of detection elements each comprising a photoelectric conversion element are arranged in a detection region, a drive circuit configured to supply a plurality of drive signals to the detection elements, and a detection circuit configured to process a detection signal output from each of the detection elements.