H04R1/086

COVER MEMBER FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
20220396475 · 2022-12-15 · ·

Provided is a cover member for an electronic device, the cover member having a through hole extending between a first surface and a second surface. The cover member for an electronic device includes a plurality of long particles that are present in an inner wall facing the through hole and whose longitudinal direction is along a through axis of the through hole in a cross section including the through axis.

Precisely Controlled Microphone Acoustic Attenuator with Protective Microphone Enclosure

Disclosed is a precisely controlled microphone acoustic attenuator that lowers the sound pressure level to minimize microphone distortion. The acoustic attenuator also serves as a protective microphone enclosure that reduces exposure to debris as well as environmental humidity and harmful gases.

Acoustic filters for microphone noise mitigation and transducer venting

Playback devices such as headphone devices can include an earpiece configured to be positioned adjacent a user's ear. The earpiece can include a transducer having a diaphragm configured to face toward the user's ear when the earpiece is positioned adjacent the user's ear, as well as an outlet vent in fluid communication with the transducer and a microphone. A support member within the earpiece includes a first opening aligned with the microphone and a second opening aligned with the outlet vent. An acoustic mesh extends over the first opening and the second opening, wherein the mesh has a substantially uniform acoustic impedance.

APPARATUS FOR DETECTING BREATH SOUNDS
20220386984 · 2022-12-08 ·

A contact sensor for monitoring breathing of a subject, comprising: a microphone housing defining a first acoustic cavity, a MEMS microphone disposed within the first acoustic cavity; a second acoustic cavity separated from the first acoustic cavity by a cavity wall having a front surface and a rear surface, the second acoustic cavity at least partially defined by the front surface of the cavity wall; an acoustic conduit formed between the first acoustic cavity and the second acoustic cavity through the cavity wall; and a pressure relief vent having a first end terminating at the second acoustic cavity and a second end terminating outside of the second acoustic cavity.

MICRO-FILTER AND ACOUSTIC DEVICE
20220377442 · 2022-11-24 · ·

Disclosed is a micro-filter comprising a substrate with a back cavity and a film layer provided on the substrate and suspended above the back cavity; the film layer has through holes distributed thereon, and is made of an amorphous metal film. Also disclosed is an acoustic device comprising the micro-filter.

WIRELESS HEADSET WITH IMPROVED WIND NOISE RESISTANCE
20220377447 · 2022-11-24 ·

An earphone device and system for improving wind resistance protection as well as controllability of true wireless stereo (TWS) headsets are provided. The earphone device includes headset microphones in a housing facing outwards and configured to generate a microphone signal. The earphone device includes a control dial rotatably attached to the housing through a pivot. The dial is substantially flat and arranged to form a narrow gap between the housing and the dial. The dial is further arranged to cover each microphone, thereby providing wind and dirt protection but leaving a gap for the sound waves to reach the microphones.

IMPROVED MICROPHONE FUNCTIONALITY IN A MULTIPORT ARRAY
20230053374 · 2023-02-23 ·

An image capture device includes a housing that includes a pattern of apertures and a microphone disposed within the housing and proximate to the apertures. The image capture device includes a membrane assembly. The membrane assembly includes a support disposed between the housing and the microphone and a channel defined in the support that directs sound waves from only one of the apertures in the pattern to the microphone. The membrane assembly further includes a membrane that extends across the channel and separates the one of the apertures and the microphone.

METHODS OF ENVIRONMENTAL PROTECTION FOR SILICON MEMS STRUCTURES IN CAVITY PACKAGES
20220369042 · 2022-11-17 ·

A sound transducer device includes a multilayer component board having a first side and an opposite second side, and a sound port extending between the first and second sides of the multilayer component board. The sound transducer also includes a MEMS sound transducer die including a suspended membrane structure, wherein the MEMS sound transducer die is arranged at the first side of the multilayer component board such that the suspended membrane structure is in fluid communication with the sound port. The sound transducer also includes a mesh structure for providing an environmental barrier, the mesh structure covering the sound port from either one of the first and second sides of the multilayer component board.

MICROPHONE ASSEMBLY
20220360877 · 2022-11-10 · ·

A microphone assembly for exterior use on vehicles having a housing base including at least one compartment, a PCBA (printed circuit board assembly) with at least one acoustic membrane, a sealing cover to at least partially overlap with the compartment is disclosed. The sealing cover has at least one opening with said opening at least partially aligned with said acoustic membrane. The assembly has a housing cover including a first grid at least partially aligned with said opening in the sealing cover, and a shielding cover. The shielding cover has a second grid at least partially aligned with said opening in the sealing cover. The first grid and the second grid are aligned in offset in order to provide a labyrinth path without straight passthrough passages from the exterior of the microphone assembly to the acoustic membrane.

Electronic device and method for manufacturing an electronic device
11492250 · 2022-11-08 · ·

In an embodiment an electronic device includes a carrier board having an upper surface, an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a flexible mounting layer arranged between the upper surface of the carrier board and the mounting side of the electronic chip, the flexible mounting layer mounting the electronic chip to the carrier board, wherein the mounting side has at least one first region and a second region, and wherein the electronic chip has at least one chip contact element in the first region and at least one connection element arranged on the at least one first region and connecting the at least one chip contact element to the upper surface of the carrier board, wherein the flexible mounting layer separates the second region from the connection element.