Certain aspects of the present disclosure provide an apparatus. The apparatus comprises a support structure comprising at least one microphone sensor, and a first material layer disposed adjacent to the support structure, wherein a first layer of air is formed between the first material layer and the support structure, the first layer of air being adjacent to the microphone sensor. In certain aspects, multiple material layers may be used, each of the material layers forming a layer of air. For instance, the apparatus may also include a second material layer disposed adjacent to the first material layer, wherein a second layer of air is formed between the first material layer and the second material layer.

The present disclosure relates to an electronic device having a side acoustic emission speaker. The electronic device may include a speaker module accommodated in the electronic device. The speaker module may include a first substrate, a speaker having a lower surface formed on the first substrate, a waterproof member contacting at least one part of an upper surface and at least one part of a first side surface of the speaker, and a second substrate contacting a second side surface of the speaker and overlapping the upper surface of the speaker. The second substrate may include a first subarea displaced from the upper surface of the speaker by a first distance and having a first thickness and a second subarea displaced from the upper surface of the speaker by a second distance and having a second thickness. A space disposed between the waterproof member and the first subarea may include an acoustic emission hole configured to transfer a sound emitted by the speaker to the outside of the electronic device.

An image capture device includes a housing having a lens snout protruding from a front housing surface. A front microphone is mounted below the lens snout. A top microphone is mounted under a top housing surface. The top microphone is positioned to receive direct freestream air flow at a first pitched forward angle. The front microphone is positioned to receive turbulent air flow at a second pitched forward angle. The second pitched forward angle is greater than or equal to the first pitched forward angle. An audio processor receives a first audio signal and a second audio signal from the top microphone and front microphone, respectively. The audio processor generates frequency sub-bands from the first and second audio signals. The audio processor selects the frequency sub-bands with the lowest noise metric and combines them to generate an output audio signal.

A microphone includes a microphone unit that converts a sound into an electrical signal. A tubular housing houses the microphone unit and includes a rear opening portion in a side surface. A step portion surrounds the rear opening portion in an inner surface of the housing. A plate-like shielding member is attached to the step portion from an inner surface side of the housing, and a circuit board housed in the housing in contact with the shielding member includes a ground pattern its side surface and in a contact position between the circuit board and the shielding member.

Audio-derived information is provided to a vehicle control system of a vehicle by attaching a microphone externally to a vehicle to generate an analog signal in response to sound waves external to the vehicle. An enclosure containing sound-attenuating material mechanically filters low frequency sounds from reaching the microphone transducer. An analog-to-digital converter converts the analog signal to a digital signal. A vehicle data bus transfers the digital signal to the vehicle control system.

A multifunctional microphone, includes a controlling mainboard; a sound collector electrically connected with the controlling mainboard; a speaker electrically connected with the controlling mainboard; and a sound adjusting module arranged on the controlling mainboard and configured to adjust sound collected by the sound collector.

Water impermeable, air permeable membrane assemblies are described herein. In some embodiments, the assemblies include a polymer membrane and at least one support structure. Certain assemblies are configured to provide an acoustic impedance having phase angle of +45 degrees to −45 over a frequency range of 50 to 20,000 Hz.

The semiconductor device includes a microelectromechanical system (MEMS) chip having a first main surface and a second main surface situated opposite the first main surface, a first glass-based substrate, on which the MEMS chip is arranged by its first main surface, and a second substrate, which is arranged on the second main surface of the MEMS chip, wherein the MEMS chip has a first recess connected to the surroundings by way of a plurality of perforation holes arranged in the first substrate.

There is provided is a stereo headphone provided with a pair of earphones having a cartilage conduction unit, a sheath unit connected to the cartilage conduction unit, and a piezoelectric bimorph of a vibration source connected to the cartilage conduction unit covered by the sheath unit without making contact with the inner wall thereof. The cartilage conduction unit is an elastic body. The cartilage conduction unit is in contact with the entrance to the external auditory meatus and has a passage hole in communication with the external auditory meatus. The vibration source is supported by a thick portion on the tragus side at the periphery of the passage hole. In accordance with a more specific feature, the thick portion is provided. The outer shape of the sheath has a thickness in the direction of the earhole that is less than the thickness in the direction orthogonal thereto.

A semiconductor device includes a microelectromechanical system (MEMS) die, an encapsulation material, a via element, a non-conductive lid, and a conductive layer. The encapsulation material laterally surrounds the MEMS die. The via element extends through the encapsulation material. The non-conductive lid is over the MEMS die and defines a cavity. The conductive layer is over the MEMS die and the encapsulation material and is electrically coupled to the via element.