A sound pickup device damping structure and a sound pickup apparatus, the sound pickup device damping structure includes: a housing, including a side wall and a peripheral wall connected with the side wall; a circuit board, fixedly connected with the peripheral wall, wherein the circuit board and the side wall and the peripheral wall enclose to form an accommodating chamber; at least one sound pickup component, located in the accommodating chamber and electrically connected with the circuit board; and a first damping layer, disposed between the side wall and the sound pickup component; wherein a second sound pickup hole in the side wall, a hole channel in the first damping layer and a first sound pickup hole disposed in the sound pickup component are communicated with each other.

A sound pickup device damping structure and a sound pickup apparatus, the sound pickup device damping structure includes: a housing, including a side wall and a peripheral wall connected with the side wall; a circuit board, fixedly connected with the peripheral wall, wherein the circuit board and the side wall and the peripheral wall enclose to form an accommodating chamber; at least one sound pickup component, located in the accommodating chamber and electrically connected with the circuit board; and a first damping layer, disposed between the side wall and the sound pickup component; wherein a second sound pickup hole in the side wall, a hole channel in the first damping layer and a first sound pickup hole disposed in the sound pickup component are communicated with each other.

An electronic device includes a housing sidewall defining an opening and a display component, such as a display cover, disposed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is defined by the sidewall and the display cover with the cavity in fluid communication with an external environment through the gap. In at least one example, an epoxy component at least partially defines the cavity and can be in direct contact with the housing sidewall.

Loudspeaker enclosures are disclosed that support improved acoustic radiation efficiency at low audible frequencies without compromising acoustic radiation efficiency at mid and high audible frequencies. Embodiments include enclosures having a primary chamber and a secondary chamber acoustically coupled to the primary chamber via a passive radiator. The geometrical characteristics of the secondary chamber and the corresponding air plenum are tailored for enhanced efficiency at low frequencies.

An electronic device including a speaker is provided. The electronic device includes a main housing, a cover housing connected to the main housing, a speaker provided inside the main housing and the cover housing, and a guide including a guide base seated on the main housing to support the speaker and a guide body extending from the guide base in a first direction and overlapping the speaker in a second direction perpendicular to the first direction.

The disclosure provides an electronic device including a substrate, a first vibrating unit, and a supporting unit. The substrate has a first surface. The first vibrating unit is disposed on the first surface and has a second surface. The second surface faces the first surface. The supporting unit is disposed between the substrate and the first vibrating unit. The first surface and the second surface are separated by a distance through the supporting unit. This distance ranges from equal to or greater than 0.06 mm to equal to or less than 65.4 mm.

A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

An earphone body includes an internal chamber, a transducer housed in the internal chamber, a first tuned vent and a second tuned vent. The transducer has a front surface facing a direction of insertion of the earphone body in use and a rear surface 6B. The internal chamber provides a proximal acoustic volume adjacent the front surface of the transducer and a distal acoustic volume adjacent the rear surface of the transducer. The first tuned vent and the second tuned vent each extend between the distal acoustic volume and the ambient environment and are adapted to provide fluid communication between the distal acoustic volume and the ambient environment. The first tuned vent is tuned to a first frequency and the second tuned vent is tuned to a second frequency, the first frequency being lower than the second frequency.