A speaker device includes: a diaphragm that radiates sound; an edge arranged in an outer periphery of the diaphragm; a frame arranged in an outer periphery of the edge, and including an annular attachment part connected to an outer peripheral region of the edge; and a connecting member arranged between the outer peripheral region and the attachment part and adhered to the outer peripheral region and the attachment part. An inner diameter of the attachment part is less than an inner diameter of the outer peripheral region

A method of making an acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes forming or providing a mold having one or more grooves in a top surface of the mold that extend in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam, the distal portion of the beam having a corrugated section including one or more grooves that correspond to the grooves of the mold. The method also includes forming a gap in the structure to define two beams separated by the gap, and releasing the structure from the mold to form one or more cantilever beams that increases an acoustic resistance of the gap between sensors.

The glass diaphragm module includes: a glass diaphragm including a glass plate structure and an exciter that is attached to the glass plate structure; a first member that is attached to a peripheral end portion of the glass diaphragm via a resin layer; and a second member that is arranged away from the glass diaphragm and that is connected to the first member, and a Young's modulus E.sub.1 of the first member and a Young's modulus E.sub.2 of the second member satisfy E.sub.2/E.sub.110.

A speaker device includes: a diaphragm that radiates sound; an edge arranged in an outer periphery of the diaphragm; an attachment part facing an outer peripheral region of the edge; and a connecting member held between the outer peripheral region of the edge and the attachment part, wherein the connecting member is adhered to at least one of the outer peripheral region or the attachment part, and the edge has a curved portion convexly curved on a sound radiation side.

A speaker device includes: a diaphragm that radiates sound; an edge arranged in an outer periphery of the diaphragm; an attachment part facing an outer peripheral region of the edge; and a connecting member held between the outer peripheral region of the edge and the attachment part, wherein the connecting member is adhered to at least one of the outer peripheral region or the attachment part, and the edge has a curved portion convexly curved on a sound radiation side.

According to one or more embodiments of the present disclosure, an electronic device may comprise: a housing; a resonance space which is disposed in the housing and in which a sound-absorbing material is accommodated; and a speaker module which is disposed in the housing and includes an acoustic filter opposite to at least a part of the resonance space, wherein the acoustic filter comprises a first plate including a first through-pattern and a second plate including a second through-pattern opposite to a part of the first through-pattern.

Disclosed is an electronic device including a sound module. The electronic device comprises: a housing in which at least one sound hole is formed; and a sound component mounted on the housing adjacent to the sound hole and configured to emit sound in a first direction toward the outside of the housing through the sound hole. The sound component includes: a sound frame forming a front surface open in the first direction; a center diaphragm disposed in the front space such that the front surface thereof faces the first direction; a vibration module including a loop disposed on the rear surface of the center diaphragm and configured to apply vibrations to the center diaphragm; and a sealing part including a seal that connects the center diaphragm and the sound frame along the circumference of the center diaphragm and provides a seal between the housing and the sound frame through a portion connected to the sound frame, wherein the sound frame and the center diaphragm may include the same material.

A loudspeaker assembly includes: a chassis; a loudspeaker, including a drive unit and a diaphragm. The diaphragm includes a body portion and inner and outer suspension portions, wherein the body portion extends between the inner and outer suspension portions. The drive unit moves the body portion along a movement axis. The body portion has a front face facing forwards and a rear face facing rearwards parallel to the movement axis. The outer suspension portion is integral with the body portion, and is attached to the chassis at a first attachment location such that the body portion is suspended from the chassis. The inner suspension portion is integral with the body portion, and is attached to the chassis at a second attachment location such that the body portion is suspended from the chassis. The first and second attachment locations have separate first and second positions along the axis, respectively.

A loudspeaker assembly includes: a chassis; a loudspeaker, including a drive unit and a diaphragm. The diaphragm includes a body portion and inner and outer suspension portions, wherein the body portion extends between the inner and outer suspension portions. The drive unit moves the body portion along a movement axis. The body portion has a front face facing forwards and a rear face facing rearwards parallel to the movement axis. The outer suspension portion is integral with the body portion, and is attached to the chassis at a first attachment location such that the body portion is suspended from the chassis. The inner suspension portion is integral with the body portion, and is attached to the chassis at a second attachment location such that the body portion is suspended from the chassis. The first and second attachment locations have separate first and second positions along the axis, respectively.

This invention unveils an optical microphone utilizing diamond cantilevers and its associated acoustic sensing system. The core component is a diamond cantilever, featuring a diamond diaphragm with a centrally located U-shaped groove. The manufacturing process involves several key steps: initially preparing the diamond diaphragm using silicon in a chemical vapor deposition setup, where methane and hydrogen are reacted under specific temperature and pressure conditions to form a diamond polycrystalline film on the silicon. This film is then separated from the substrate to create the diaphragm. Subsequently, a U-shaped groove is crafted on the diaphragm by applying a dry etching template and etching, resulting in the formation of the diamond cantilever, with a thickness ranging from 10 to 100 m. This method establishes a novel approach to creating sensitive and durable optical microphones.