A solid state relay module configured to be coupled to an electronics enclosure. The solid state relay module includes a body with a first side and an opposite second side and two cable channels extending from the first side of the body. Each of the two cable channels is sized to receive a heating cable. The solid state module also includes a solid state relay platform defined between the two cable channels, where the solid state relay platform is sized to receive a solid state relay. The solid state relay module further includes a heat sink extending from the second side of the body.

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

The present invention discloses a heat radiator, especially an infrared radiator, having at least one radiation source by means of which supplied electrical energy is convertible into heat radiation, as well as a control. This control comprises at least one frequency converter having a first, a second and a third output so that between the first and the third output a first alternating current is providable and between the second and the third output a second alternating current is providable by means of which the at least one radiation source is operable.

Power outputs in a heating control and/or regulation device are each electrically connectable to a heating element, especially a radiant heater. A power input is able to be connected electrically to a power supply for the heating elements. A power distribution device is connected electrically on its input side to the power input and is connected electrically on its output side via a branch to each of the power outputs to supply the power outputs with electric power from the power supply. A switching element is disposed in each of the branches or between each of the power outputs and the heating elements. A control and/or regulation unit is configured such that it controls and/or regulates the switching state of the switching elements as a function of set values. An interface receiving set values has at least one additional connection to a temperature measurement device that measures actual values of temperature. The control and/or regulation unit is configured such that it acquires the actual values of the temperature from the temperature measurement device and additionally controls and/or regulates the switching state of the switching elements as a function of these actual values of the temperature.

A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.

Disclosed are a method for controlling the temperature of a heating apparatus in an electrically-heated smoking system and an electrically-heated smoking system, the method includes: providing a constant or variable preset temperature value; outputting a constant current to a heating apparatus by a constant current source; and controlling an actual temperature of the heating apparatus to be maintained at a preset temperature, wherein the temperature control step comprises: obtaining a voltage value corresponding to the constant current at the two ends of the electrical heating apparatus; deriving the actual temperature value of the heating apparatus according to the voltage value; comparing the actual temperature value of the heating apparatus with the preset temperature; and maintaining the actual temperature value of the heating apparatus at the preset temperature by adjusting a heating power supply.

The present invention involves calibrating a control system to enable resistance-based control of a heat tracing circuit, that includes characterizing a piece of heat trace to determine a relationship between resistance and temperature, allowing for more precise control. Also described are different methods for practical resistance-based control of a heat trace system. Further described are several methods to monitor heat trace: including methods to enhance monitoring capabilities using a system operating model; comparison to historical operating data; and inclusion of information from external sources. Also provided is a method by which a piece of heat trace of unknown length and power factor can be controlled using the resistance-based method when other system information is available.

A system for measurement is provided. The system comprises a core optical module and a scanning interface module. The core optical module is configured to generate a light for generating signals for analyzing an object through the scanning interface module and detect a light including the signals from the object through the scanning interface module. The scanning interface module is changeable for each application and configured to connect with the core optical module by a light transferring unit to scan the object with the transferred light from the core optical module and to receive the light from the object to transfer to the core optical module.

An apparatus for processing a substrate may include a process chamber in which a desired process is performed, a supporting unit disposed in the process chamber, and a heater array disposed in the supporting unit. The heater array may include a plurality of heaters providing a plurality of heating areas, a plurality of diodes electrically connected to the plurality of heaters, respectively, and a controller operating the plurality of heaters. Here, adjacent diodes in the plurality of heating areas are arranged in opposed directions.

A post-heating treatment device includes a detecting device for a height variation of a surface of the rail at every, predetermined pitch along a length direction of the rail, a control unit for defining a position of the rail to be a starting point of the welded section when the height variation detected by the detecting device at every predetermined pitch exceeds a predetermined threshold for the number of a predetermined times consecutively and defining a position of the rail to be an end point of the welded section when the height variation detected by the detecting device at every predetermined pitch is below the predetermined threshold for the number of the predetermined times consecutively, and a heating unit for heat treatment based on a position of the welded section detected by the detecting device. A post-heating treatment method using the post-heating treatment device is provided.