Disclosed are fast high-temperature sintering systems and methods. A method of fabrication includes positioning a material at a distance of 0-1 centimeters from a first conductive carbon element and at a distance of 0-1 centimeters from a second conductive carbon element, heating the first conductive carbon element and the second conductive carbon element by electrical current to a temperature between 500° C. and 3000° C., inclusive, and fabricating a sintered material by heating the material with the heated first conductive carbon element and the heated second conductive carbon element for a time period between one second and one hour. Other variations of the fast high-temperature sintering systems and methods are also disclosed. The disclosed systems and methods can quickly fabricate unique structures not feasible with conventional sintering processes.

A method for heating an electrical bus in an electrical cabinet containing at least one current conversion device includes determining a temperature inside of the electrical cabinet. The method also includes determining a temperature outside of the electrical cabinet. Further, the method includes applying heat to the electrical bus via conduction when the temperature outside of the electrical cabinet is below a predetermined temperature threshold or a difference between the temperature inside of the electrical cabinet and the temperature outside of the electrical cabinet is less than a desired temperature difference.

A plasma processing apparatus includes: a plasma processing chamber; a first conductive member disposed in the plasma processing chamber and having a first surface; a second conductive member having a second surface facing the first surface of the first conductive member; a third member disposed on at least one selected from the group of the first conductive member and the second conductive member and having a shape that varies according to a temperature change of the third member; and a control mechanism configured to change a temperature of the third member.

An information handling system includes a battery, a first temperature sensor, an electric heater, and a processor. The battery provides power to one or more other components of the information handling system. The first temperature sensor measures a temperature within the information handling system. The electric heater receives a current, and provides heat to the battery based on the reception of the current. The processor determines if the battery is in an idle or charging state. In response to the battery being in the idle state or the charging state, the processor receives an ambient temperature of the information handling system from the first temperature sensor. The processor determines whether the ambient temperature is below a first threshold temperature. In response to the ambient temperature being below the first threshold temperature, the processor provides the current to the electric heater to heat the battery.

An electromagnetic illuminator heater is provided having a heat generating wire and an elongate encasement of thermally transmissive, temperature mitigating, and electrically insulative material. The material encompasses the elongate heating wire. A heater for devices is also provided.

Localized heating can use a fixed-frequency planar transmission line resonators arranged along a main-line, selected by tuning an electromagnetic input signal frequency applied to the main line for depositing heat in an adjacent active substrate. More generally, adjusting input signal frequency can be used to selectively address and energize an electromagnetic-to-heat, an electromagnetic-to-vibration, or other transducer to controllably direct energy toward a desired transducer load. Resonators or other electromagnetically energized transducers can be arranged to electromagnetically interfere, such that specifying or adjusting a relative phase of applied electrical signals can be used to specify or adjust the energy directed toward a desired transducer load. Temperature sensing can characterize a material in a target region near the transducer. A cold-hot-cold temperature profile can better manage temperature and avoid overheating a dielectric material such as the active substrate material.

An apparatus, system and method for a carrier suitable to carry a circuit board through a semiconductor underfill process. The apparatus, system and method includes a modular carrier capable of supporting a printed circuit board during at least an underfill process, the modular carrier comprising: an outer frame having, at least about a center point thereof, at least one open aspect; and at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board.

Provided is a power control device 100 comprising: a current detector 31 that measures a combined current value obtained by combining currents flowing through a plurality of loads 1-4; and an output calculation unit 11 that calculates a correction value obtained by dividing a total value of products of operation output values for the loads 1-4 and rated current values of the loads 1-4, respectively, by the combined current value obtained by the current detector 31, and that performs power supply control for the loads 1-4 on the basis of a corrected operation output value that is a product of the operation output value and the correction value for each of the loads 1-4, in which in a system that heats or cools a workpiece by means of a plurality of loads, heating control or cooling control can be performed in which an effect of a fluctuation in load characteristics is reduced.

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.

Provided is a welding joining method for joining end portions of first and second pipes made of polyamide resin by bonding the end portions to each other by pressure in a molten state. The welding joining method includes: a placing step of placing an infrared radiation lamp between the first and second pipes placed to face each other at an interval; a heating and melting step of heating and melting the end portions of the first and second pipes by emitting infrared; and a pressure bonding step of cooling down the molten end portions in a state where the molten end portions are bonded to each other by pressure.