A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.

A heating circuit is provided. The heating circuit is disposed in a chip which has a normal operation temperature range. The heating circuit includes a comparison circuit and a thermal-energy generation circuit. The comparison circuit compares a temperature voltage with a first threshold voltage. The temperature voltage represents a temperature of the chip. The thermal-energy generation circuit is controlled by the comparison circuit. When the temperature voltage is less than the first threshold voltage, the comparison circuit enables the thermal-energy generation circuit to generate thermal energy to raise the temperature of the chip.

A modular LED heater and an LED array are disclosed. The modular LED heater comprises a base having one or more internal conduits through which a coolant fluid may flow. The base also includes a plumbing port on one side wall of the base and a recessed port on an opposite side of the base. These ports are configured such that the plumbing port of one modular LED heater can be inserted into the recessed port of the adjacent modular LED heater to form a fluid-tight seal. A printed circuit board having a plurality of LEDs is disposed on the front surface of the base. Further, in some embodiments, the base includes one or more wedge clamps on its side walls used to lock the modular LED heater to an adjacent modular LED heater. An LED array may be created by assembling a plurality of these modular LED heaters.

Examples disclosed herein relate to a lamp configured to provide heat for a processing chamber. The lamp includes a housing filled with a gas. A filament is disposed within the housing. The filament has an upper diameter, a lower diameter, and a length. A pair of electrodes is electrically coupled to the filament. A pair of pins is electrically coupled to the pair of electrodes. The pair of pins is configured to transfer energy to the filament. A ratio between either the upper diameter or the lower diameter to the length is about 0.3. The upper diameter is not equal to the lower diameter.

A light irradiation unit includes a substrate having a longitudinal direction, the longitudinal direction being a first axis direction; multiple light sources arranged along the first axis direction on a first surface of the substrate; a heat dissipation member arranged on a second surface of the substrate opposite to the first surface; and a housing having a pair of first side surfaces holding the heat dissipation member therebetween in a second axis direction orthogonal to the first axis direction along the first surface. The substrate has, at an end portion in the first axis direction, an end surface intersecting the first axis direction. The location of the end surface in the first axis direction is near an edge of the first side surface along the first axis direction. The end surface is exposed from the housing or covered by a detachable protection member.

A ring support is attached to an inner wall surface of a chamber that houses a semiconductor wafer to support a susceptor. When the semiconductor wafer is placed on the susceptor, an inner space of the chamber is separated into an upper space and a lower space. Particles are likely to accumulate on a lower chamber window as a floor part of the chamber. However, since the upper space and the lower space are separated, the semiconductor wafer can be prevented from being contaminated by the particles flowing into the upper space and adhering to a surface of the semiconductor wafer even when the particles on the lower chamber window are blown up by irradiation with flash light.

A substrate support device relating to technology disclosed in the description of the present application includes: a holding plate for opposing a substrate bowable by being heated by irradiation with flash light; and a plurality of substrate support pins provided on the holding plate and being for supporting the substrate, wherein the plurality of substrate support pins are arranged at locations where a volume of a space between the holding plate and the substrate in an unbowed state and a volume of a space between the holding plate and the substrate in a bowed state are equal to each other. Breakage of the substrate can be suppressed in a case where the substrate is bowed by flash light.

A gas ring is attached to an upper portion of a chamber side portion as a side wall of a chamber. The gas ring is formed by overlapping an upper ring and a lower ring. A gap between the upper ring and the lower ring provides a flow path for processing gas. A labyrinthine resisting unit is formed in the flow path. The mass of the lower ring having an inner wall surface is increased to increase heat capacity. The lower ring is attached to the chamber side portion to be in surface contact with the chamber side portion, so that thermal conductivity from the lower ring to the chamber side portion has a large value, and the amount of heat accumulated in the lower ring is reduced. An increase in temperature of the lower ring at thermal processing is thereby suppressed to prevent discoloration of the gas ring.

A modular LED heater and an LED array are disclosed. The modular LED heater comprises a base having one or more internal conduits through which a coolant fluid may flow. The base also includes a plumbing port on one side wall of the base and a recessed port on an opposite side of the base. These ports are configured such that the plumbing port of one modular LED heater can be inserted into the recessed port of the adjacent modular LED heater to form a fluid-tight seal. A printed circuit board having a plurality of LEDs is disposed on the front surface of the base. Further, in some embodiments, the base includes one or more wedge clamps on its side walls used to lock the modular LED heater to an adjacent modular LED heater. An LED array may be created by assembling a plurality of these modular LED heaters.

A first flash heating is performed in which a flash lamp emits a first flashing light to a semiconductor wafer having been heated to a first preheating temperature equal to or lower than 650 degrees C. by a light emission from a halogen lamp so that the temperature of a surface of the semiconductor wafer reaches 1000 degrees C. or higher. Then, a second flash heating is performed in which a second flashing light is emitted to the semiconductor wafer having been further heated by a light emission of the halogen lamp. Performing the first flash heating can suppress diffusion of impurity in the subsequent second flash heating. In the second flash heating, the impurity is activated and introduced crystal defects are recovered.