Disclosed is a chip structure that includes heater. The heater includes a heating element with a first end and a second end and, between the first and second ends, different portions with different cross-sectional areas. The heating element further includes first and second terminals at the first and second ends, respectively. Current flowing through the heating element between the first and second terminals causes the heating element to generate heat. However, due to the different cross-sectional areas of the different portions, the current densities through those different portions are different and, thus, the different portions of the heating element generate different amounts of heat per unit length. The heating element can be designed and placed on-chip to facilitate local thermal tuning of different regions of a device or of different devices without requiring multiple different heating elements within a relatively small chip area. Also disclosed is an associated method.

A vapor-generating system includes a cartridge including a first vapor-forming substrate, the cartridge having an annular shape and at least one end configured to abut a flange and at least partially cover a device air inlet, and a vapor-generating device having an outer surface that defines the flange, the vapor-generating device being configured to be overlain by the cartridge such that the cartridge is coupled against the flange, the vapor-generating device including a liquid storage section containing a second vapor-forming substrate, the second vapor-forming substrate being a liquid substrate, and a power supply section, the liquid storage section being configured to removably attach to the power supply section such that at least one of the flange and the device air inlet are defined by outer surfaces of the liquid storage section and the power supply section.

A vapor-generating system includes a cartridge including a first vapor-forming substrate, the cartridge having an annular shape and at least one end configured to abut a flange and at least partially cover a device air inlet, and a vapor-generating device having an outer surface that defines the flange, the vapor-generating device being configured to be overlain by the cartridge such that the cartridge is coupled against the flange, the vapor-generating device including a liquid storage section containing a second vapor-forming substrate, the second vapor-forming substrate being a liquid substrate, and a power supply section, the liquid storage section being configured to removably attach to the power supply section such that at least one of the flange and the device air inlet are defined by outer surfaces of the liquid storage section and the power supply section.

A vaporizer cartridge configured to efficiently and effectively heat a non-liquid source material that includes a vaporizable material is described. The cartridge may include a heating element including an electrically resistive material and may be configured to vaporize the vaporizable material by delivery of heat to the vaporizable material. The cartridge may include a cartridge contact in electrical communication with the electrically resistive material. The cartridge contact may be configured to couple to a vaporizer contact positioned proximate to a cartridge coupling feature to allow electrical power to pass from the vaporizer device through the electrically resistive material. The electrical power may cause heating of the electrically resistive material and the vaporizable material to result in generation of an aerosol for inhalation by a user. Related systems, methods, and articles of manufacture are also described.

Disclosed is a chip structure that includes heater. The heater includes a heating element with a first end and a second end and, between the first and second ends, different portions with different cross-sectional areas. The heating element further includes first and second terminals at the first and second ends, respectively. Current flowing through the heating element between the first and second terminals causes the heating element to generate heat. However, due to the different cross-sectional areas of the different portions, the current densities through those different portions are different and, thus, the different portions of the heating element generate different amounts of heat per unit length. The heating element can be designed and placed on-chip to facilitate local thermal tuning of different regions of a device or of different devices without requiring multiple different heating elements within a relatively small chip area. Also disclosed is an associated method.

An electric heating device includes a housing forming a receptacle and a fluid channel The receptable holds a PTC element. In order to reduce weight and assembly effort, the housing is formed by a uniform extruded profile.

A PTC thermistor module for a temperature control device may include at least one PTC thermistor element, two electrically insulating insulator plates, and a plurality of electrical conductors. The PTC thermistor element may have a flat element cross section, two opposing large outer surfaces, and two opposing small outer surfaces connecting the two large outer surfaces. The two insulator plates may be respectively connected to one of the two large outer surfaces. The plurality of electrical conductors may be configured as a plurality of electrically conductive conductor coatings, which may each be disposed on an associated insulator plate of the two insulator plates. At least one first conductor coating may be electrically connected to a first large outer surface of the two large outer surfaces. At least two second conductor coatings may be electrically connected to a second large outer surface of the two large outer surfaces.

This disclosure relates to a multi-planar heater element for use in a high-speed oven with a new tensioning system. Disclosed subject matter includes a radiative heater for use in a high-speed oven formed from two or more planar heater elements stacked closely to form an effective single element and allowing for extended life through the minimization of concentrated eddy currents in both elements. The disclosure further includes structures to install and remove various planar heating elements without any external tools.

This disclosure relates to a multi-planar heater element for use in a high-speed oven with a new tensioning system. Disclosed subject matter includes a radiative heater for use in a high-speed oven formed from two or more planar heater elements stacked closely to form an effective single element and allowing for extended life through the minimization of concentrated eddy currents in both elements. The disclosure further includes structures to install and remove various planar heating elements without any external tools.

A process for manufacturing a PTC heating element that includes at least one PTC component (20) and a carrier (14, 16) permanently connected to the PTC component on at least one side (24, 26) of thereof The process includes applying electrically conductive sintered material (28, 30, 36, 38) on the one side of the PTC component, which side is to be permanently connected to a carrier. Subsequently, a contact of the PTC component is established with at least one carrier such that sintered material, which was applied between the PTC component and the carrier and is intended for establishing a connection between the at least one PTC component and the at least one carrier, is positioned. The sintered material, which material has been positioned between the PTC component and the carrier, is sintered by heating or/and by applying pressure.