A member for a semiconductor manufacturing apparatus includes a disk-shaped or annular ceramic heater, a metal base, an adhesive element bonding the metal base and the ceramic heater, an adhesive protective element disposed between the ceramic heater and the metal base to extend along a periphery of the adhesive element, and an anti-adhesion layer disposed between the adhesive element and the protective element, the anti-adhesion layer preventing adhesion between the adhesive element and the protective element.

An electric heating device, in particular for mobile applications, having a substrate and a heat conductor layer formed on the substrate. The heat conductor layer is interrupted by at least a first isolating interruption, the first isolating interruption separating at least a first and a second layer portion of the heat conductor layer from one another. The first layer portion is connected at a first end to a first terminal, for example positive pole, and the second layer portion is connected at a first end to a second terminal, for example negative pole. The first layer portion is connected at a second end to the second layer portion and is connected via this second layer portion to the second terminal.

A heater includes a base, a resistive heating body, and a terminal portion. The base is formed of ceramic and has a plate shape. The resistive heating body is located in the base. The terminal portion is electrically connected to the resistive heating body. The base includes a protruding portion surrounding the terminal portion, on a lower surface side. The protruding portion is formed of a ceramic member, and the terminal portion passes through a through hole formed in the ceramic member. The ceramic member is bonded to at least one of the lower surface of the base or the terminal portion.

Various embodiments of the subject technology may provide methods and apparatus for using a cartridge to vaporize a vaporizable liquid. The methods and apparatus for using the cartridge to vaporize the vaporizable liquid may include drawing air into an airflow path of the cartridge. The methods and apparatus for using the cartridge to vaporize the vaporizable liquid may also include vaporizing a first portion of the vaporizable liquid by conductively heating the first portion as the air is drawn into the airflow path. The methods and apparatus for using the cartridge to vaporize the vaporizable liquid may further include vaporizing a second portion of the vaporizable liquid by convectively heating the second portion as the air flows along the airflow path.

Various embodiments of the subject technology may provide methods and apparatus for using a cartridge to vaporize a vaporizable liquid. The methods and apparatus for using the cartridge to vaporize the vaporizable liquid may include drawing air into an airflow path of the cartridge. The methods and apparatus for using the cartridge to vaporize the vaporizable liquid may also include vaporizing a first portion of the vaporizable liquid by conductively heating the first portion as the air is drawn into the airflow path. The methods and apparatus for using the cartridge to vaporize the vaporizable liquid may further include vaporizing a second portion of the vaporizable liquid by convectively heating the second portion as the air flows along the airflow path.

A heater includes a heat generating member in a first layer, a sensor that is in a second layer different from the first layer and configured to detect a temperature of the heat generating member, and a wiring pattern in one or more third layers between the first and second layers to supply power to the heat generating member.

A heater includes a heat generating member in a first layer, a sensor that is in a second layer different from the first layer and configured to detect a temperature of the heat generating member, and a wiring pattern in one or more third layers between the first and second layers to supply power to the heat generating member.

A treatment instrument including a heat transmitter that includes a treating surface and an installation surface, a substrate attached to the installation surface, and a heat generator formed on a surface of the substrate. The substrate surface and heat generator together form an uneven surface. First and second adhesion layers formed of a material having thermal conductivity and electrical insulation are provided between the installation surface and the substrate. The first adhesion layer is in close contact with the installation surface, and the second adhesion layer is in close contact with the heat generator and the substrate surface. The second adhesion layer is inserted into a recess in the uneven surface formed by the heat generator on substrate surface so as to increase the contact area between the second adhesion layer and the uneven surface.

A heating device for an electric cooktop has at least one long heating conductor, one support body on the top side of which the heating conductor is arranged and fitted, and one supporting means for the support body. The heating conductor is designed as a corrugated flat strip which has, on its bottom side, holding elements which are arranged at a distance from one another and integrally project downward and are pushed into the support body. The supporting means supports the support body, at least in its outer region along an outer edge, at the bottom. The support body consists, as a thin plate, of compressed and adhesively bonded mica material, for example micanite, and is therefore electrically insulating and sufficiently stable.

A printed circuit board includes a conducting path shaped via a subtractive method and a heating line. The heating line is formed by the conducting path and designed to have a predetermined heating power for a heating fluid. The printed circuit board further includes a heat dispersion layer designed for transferring heat to the fluid. A heater includes such a printed circuit board.