A specimen heating apparatus includes a heater unit configured to heat a test specimen held in a material testing machine, a heater holding unit configured to hold the heater unit in a set position relative to the test specimen for heating, a specimen temperature measurement unit attached to the heater unit and configured to measure temperature of the test specimen when the heater unit is in the set position, a temperature controller configured to control heating of the heater unit in response to a temperature measured by the specimen temperature measurement unit, and a thermal insulation unit configured to cover the heater unit, wherein the heater holding unit holds the heater unit in such a way that the heater unit is allowed to be brought to and removed from the set position while the test specimen is being held in the material testing machine.

A wafer holder includes a mounting table that has a mounting surface for a workpiece at a top, a supporting member that supports the mounting table from a lower side, a first cylindrical member one end of which is joined hermetically to a lower surface of the mounting table, and a second cylindrical member that is provided inside the first cylindrical member and one end of which is joined hermetically to the lower surface of the mounting table.

A ceramic heater includes: a ceramic plate which is provided with a wafer placement surface on an upper surface and in which a heating resistor is internally embedded; a ceramic tubular shaft with an upper end bonded to a lower surface of the plate; and power feeding members which penetrate a peripheral wall part of the tubular shaft in a vertical direction, and are electrically connected to the heating resistor. The power feeding members are embedded in the peripheral wall part of the tubular shaft, and are in tight contact with a ceramic material of the tubular shaft.

A flooring underlayment includes a base membrane and a cover membrane. The base membrane is configured to be installed between a subfloor and floor tiles to allow movement of the floor tiles relative to the subfloor. The cover membrane is configured to be coupled to the base membrane to form a flat surface for supporting the floor tiles. The cover membrane is configured to be coupled to the base membrane using at least one of a snug fit and a snap fit.

A base structure includes a base, a first conductor layer, and a via conductor. The base has a first surface. The first conductor layer is positioned along the first surface in the base. The via conductor includes a first part and a second part in a section that includes the via conductor and that extends in a first direction perpendicular to the first surface. The length of the first part in the first direction is larger than the thickness of the first conductor layer. The length of the second part in the first direction is larger than the thickness of the first conductor layer. The second part is continuous with the first part, and at least a portion of the outer edge of the second part is displaced from the outer edge of the first part when viewed in the first direction.

A base structure includes a base, a first conductor layer, and a via conductor. The base has a first surface. The first conductor layer is positioned along the first surface in the base. The via conductor includes a first part and a second part in a section that includes the via conductor and that extends in a first direction perpendicular to the first surface. The length of the first part in the first direction is larger than the thickness of the first conductor layer. The length of the second part in the first direction is larger than the thickness of the first conductor layer. The second part is continuous with the first part, and at least a portion of the outer edge of the second part is displaced from the outer edge of the first part when viewed in the first direction.

A support frame of a thin electric heating band contains: a body, multiple first blades, multiple second blades, multiple fixing sheets, and multiple defining elements. The body includes a base and multiple supporting arms. Each first blade includes multiple first spaced recesses, and each second blade includes multiple second spaced recesses, such that the thin electric heating band is engaged in each first spaced recess and each second spaced recess, thus positioning the thin electric heating band. Each fixing sheet is stacked on each first blade and includes multiple spaced notches, and each spaced notch communicates with each first spaced recess laterally. Each first blade includes an air facing fringe and an air shadow fringe, and each defining element is fixed on the air shadow fringe of each first blade.

Examples of a susceptor for supporting a substrate includes a base metal formed of aluminum or a material containing aluminum, an anodized layer covering a surface of the base metal and having cracks therein, and a CF coating of polymer provided in the cracks such that the exposure of the base metal is avoided.

A ceramic heater includes a disc-shaped ceramic plate having a wafer placement surface, and a shaft provided on a surface on an opposite side of the wafer placement surface of the ceramic plate. First and second resistance heating elements are embedded inside the ceramic plate. When the ceramic plate is viewed from above, the gap (first gap) between first turn-back sections which face each other in a circumferential direction, and the gap (second gap) between second turn-back sections which face each other in a circumferential direction are arranged so as not to overlap.

A heater (1a) includes a substrate (10), a heating element (20) that is a transparent conductive film (20), an intermediate layer (30), and at least a pair of power supply electrodes (40). The intermediate layer (30) is disposed between the substrate (10) and the transparent conductive film (20), and has a first principal surface (31) positioned closer to the transparent conductive film (20) than the substrate (10). The pair of power supply electrodes (40) are in contact with the transparent conductive film (20). The intermediate layer (30) contains an organic polymer (32) forming a cured product and particles (34) of silica or a metal oxide dispersed in the cured product. The transparent conductive film (20) has a surface having an arithmetic average roughness Ra, specified in JIS B 0601:2013, of 7.0 nm or less.