Provided is a uniformly-heating system for curing concrete. A uniformly-heating system for curing concrete according to an embodiment of the present application includes a plurality of unit heating devices each is coupled to an external panel of a form for concrete manufacturing in a in close contact state therewith, and a power supply unit that supplies power to the plurality of unit heating devices, wherein the unit heating device includes a body housing that is attached to a surface of the form and has a predetermined unit area, a gripping portion that is coupled to an upper surface of the body housing, and a planar heating heater that is coupled to a lower surface of the body housing.

Provided is a uniformly-heating system for curing concrete. A uniformly-heating system for curing concrete according to an embodiment of the present application includes a plurality of unit heating devices each is coupled to an external panel of a form for concrete manufacturing in a in close contact state therewith, and a power supply unit that supplies power to the plurality of unit heating devices, wherein the unit heating device includes a body housing that is attached to a surface of the form and has a predetermined unit area, a gripping portion that is coupled to an upper surface of the body housing, and a planar heating heater that is coupled to a lower surface of the body housing.

An electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater unit. The heater unit includes a first power feeding portion, a second power feeding portion, and a heater line. The heater line includes a plurality of extension portions arranged in a second direction. The plurality of extension portions includes a first extension portion and a second extension portion. A third distance between the first extension portion and a first virtual tangent and a fourth distance between the second extension portion and a second virtual tangent each are not more than a first distance between the first power feeding portion and the second power feeding portion. The third distance and the fourth distance each are not more than a second distance between the plurality of extension portions.

A heater (1a) includes a support (10) made of an organic polymer and having a sheet shape, a heating element (20), and at least one pair of power supply electrodes (30) in contact with the heating element (20). The heating element (20) is a transparent conductive film made of a polycrystalline material containing indium oxide as a main component. In the heater (1a), the heating element (20) has a specific resistance of 1.4×10.sup.−4 Ω.Math.cm to 3×10.sup.−4 Ω.Math.cm. The heating element (20) has a thickness of more than 20 nm and not more than 100 nm.

A cooking device according to one example embodiment includes a plurality of modular heaters. Each modular heater includes a ceramic substrate and an electrically resistive trace positioned on the ceramic substrate. Each modular heater is configured to generate heat when an electric current is supplied to the electrically resistive trace. The cooking device includes a thermally conductive heating plate. The plurality of modular heaters are positioned against a bottom surface of the heating plate. The heating plate includes a top surface positioned to transfer heat provided by the plurality of modular heaters to a cooking vessel for cooking an item held by the cooking vessel.

A system for semiconductor fabrication having at least one heated valve manifold assembly comprising a heat-conductive plate having a total surface area, said conductive plate having a first side and a second side; at least one heater contacting said at least one heat-conductive plate; a valve manifold comprising a plurality of valves and pipes; said plurality of said valves and pipes having a total surface area wherein a portion of the surface area of said plurality of valves and pipes contacts said at least one heat-conductive plate; and one or more layers of insulation covering: (i) a majority of the surface area of said plurality of said valves and pipes where said portion contacts said at least one heat-conductive plate, (ii) said at least one heater in contact with said at least one heat-conductive plate, and (iii) the majority of the surface area of said at least one heat-conductive plate.

An electrostatic chuck includes a ceramic dielectric substrate; a base plate; and a heater unit which heats the ceramic dielectric substrate. The heater unit includes a first heater element. The first heater element has a plurality of sub-zones. The sub-zones include a first sub-zone. The first sub-zone includes a sub-heater line generating heat by allowing a current to flow, a first sub-power feeding portion feeding a power to the sub-heater line, and a second sub-power feeding portion feeding a power to the sub-heater line. The first sub-zone has a central region located centrally in the first sub-zone and an outer peripheral region located outside the central region when viewed along a Z-direction perpendicular to the first major surface. At least one of the first sub-power feeding portion and the second sub-power feeding portion is provided in the central region.

A reactor system for use in semiconductor processing that makes use of a liquid source for deposition that needs to be maintained within a specific temperature control band or range. The reactor system includes a temperature control system that includes a heating and cooling apparatus for providing both heating and cooling of a vessel that stores the liquid source to maintain the liquid source within a desired temperature control band or range. In this manner, the heating and cooling apparatus may be used in a reactor system in which the vessel needs to be cooled, needs to be heated, or uses concurrent or alternating heating and cooling to provide enhanced control of the source temperature within a particular temperature control band.

A heater power feeding mechanism for independently controlling temperatures of zones of a stage on which a substrate is placed. The respective zones of the stage include heaters. The heater power feeding mechanism includes a plurality of heater terminals configured to be connected to the heaters, a plurality of heater wires connected to the heater terminals, and an offset structure that offsets the heater wires from each other. The heater terminals are disposed on the periphery of a holding plate for holding the stage.

A heater includes a sintered assembly and a functional element disposed on one of opposing surfaces of the sintered assembly. The heater is manufactured by a method that includes hot pressing a ceramic powder and a plurality of first slugs and forming the sintered assembly including a ceramic substrate and the plurality of first slugs embedded therein, forming the functional element on the one opposing surface of the sintered assembly such that the functional element is connected to the plurality of first slugs, and forming a monolithic substrate in which the functional element and the plurality of first slugs are embedded.