Provided are an apparatus and a method of detecting an error in the apparatus. The apparatus includes an image former and an induction heating fusing device. The image former forms an image. The induction heating fusing device fuses the image formed by the image former onto paper. Whether the apparatus has an error is determined by limiting a current applied to a resonance circuit included in the induction heating fusing device to less than a certain level.

A device comprising at least one pressure generation unit and a heating unit, the heating unit comprising a two-sided inductor and being configured to generate a uniform alternating magnetic field in an assembly comprising two parts made of composite materials comprising carbon fibers embedded in a resin and a field absorber. The field absorber is configured to absorb the magnetic field and comprising a ferromagnetic material. The field absorber is arranged at the contact walls of the two parts, so as to heat them to at least a transformation temperature of the resin.

Method and system for thermal treatment by heat induction of a metal piece on a targeted zone. According to the method, the thermal treatment is carried out using a thermal element mounted on a robotic system for moving the thermal element along a cyclical trajectory on the targeted zone so as to heat the target zone and minimize the temperature deviations over the targeted zone.

Method and system for thermal treatment by heat induction of a metal piece on a targeted zone. According to the method, the thermal treatment is carried out using a thermal element mounted on a robotic system for moving the thermal element along a cyclical trajectory on the targeted zone so as to heat the target zone and minimize the temperature deviations over the targeted zone.

An induction heating device for a metal strip, including: an induction coil provided on one side or on both sides of a front face side or a reverse face side of a metal strip, and that induces an induction current in the strip when a primary current is passed through the coil, the induction current configuring a closed loop as viewed from a direction perpendicular to a metal strip face; plural magnetic cores disposed at a specific position, this being a position at a back face side of the coil and separated from the strip by a specific distance, to concentrate magnetic flux generated by the coil in the strip; and a moving mechanism coupled to the magnetic cores, and that moves the cores to increase or decrease a disposed number of the cores at the specific position disposed side-by-side along a metal strip width direction.

An induction heating device for a metal strip, including: an induction coil provided on one side or on both sides of a front face side or a reverse face side of a metal strip, and that induces an induction current in the strip when a primary current is passed through the coil, the induction current configuring a closed loop as viewed from a direction perpendicular to a metal strip face; plural magnetic cores disposed at a specific position, this being a position at a back face side of the coil and separated from the strip by a specific distance, to concentrate magnetic flux generated by the coil in the strip; and a moving mechanism coupled to the magnetic cores, and that moves the cores to increase or decrease a disposed number of the cores at the specific position disposed side-by-side along a metal strip width direction.

A heating apparatus, a method and a system for producing semiconductor chips in a wafer assembly are disclosed. In an embodiment a method for producing semiconductor chips in a wafer composite includes providing a carrier having a wafer plane and a reference point, wherein the carrier is configured to accommodate at least one wafer composite in the wafer plane, providing a heating device comprising a heating plane and a first heating unit arranged laterally offset from the reference point in the heating plane, and arranging the heating device with its heating plane parallel to the wafer plane, arranging at least one wafer composite in the wafer plane of the carrier, rotating the carrier and the heating device relative to each other about an axis perpendicular to the heating plane and the wafer plane through the reference point, controlling the first heating unit such that a temperature of the carrier is influenced, providing a bending sensor for determining a bending characteristic value, the bending characteristic value being representative of a bending of the at least one wafer composite relative to the wafer plane and controlling the first heating unit based on the bending characteristic value.

A connecting method includes: measuring at least one of control dimensions that influence a dimension of a member obtained by connection of a first member and a second member to each other, the second member including a connection insertion portion where the first member is inserted; determining, according to the at least one of the control dimensions, a relative position for positioning the first member and the second member by insertion of the first member in the connection insertion portion; heating the second member to a first temperature; inserting the first member in the connection insertion portion to place the first member and the second member in the relative position; and stopping the heating of the second member and maintaining the first member and the second member in the relative position.

This disclosure relates to determining a material transition point such as a melt-point, and to determining an annealing parameter based on the determined material transition point. Changes in a parameter associated with an electromagnetic circuit coupled to an object subject to heating are monitored. A material transition point is determined upon detecting a predetermined change in the parameter. The annealing parameter is derived from the determined material transition point.

This disclosure relates to determining a material transition point such as a melt-point, and to determining an annealing parameter based on the determined material transition point. Changes in a parameter associated with an electromagnetic circuit coupled to an object subject to heating are monitored. A material transition point is determined upon detecting a predetermined change in the parameter. The annealing parameter is derived from the determined material transition point.