An inductive heating arrangement is provided, including: a first inductor coil to generate a first varying magnetic field when a varying electric current flows through the first coil; a second inductor coil to generate a second varying magnetic field when a varying electric current flows through the second coil; and a tubular-shaped flux concentrator around the first coil and to distort the first field, including a main portion around the first coil and having an inner diameter, first and second ends, a first end portion having an inner diameter smaller than that of the main portion, and a second end portion having an inner diameter smaller than that of the main portion, an inner surface of the flux concentrator defining an annular channel between the first and second end portions, and the first inductor coil being disposed within the annular channel between the first and second end portions.

An inductive heating arrangement is provided, including: a first inductor coil to generate a first varying magnetic field when a varying electric current flows through the first coil; a second inductor coil to generate a second varying magnetic field when a varying electric current flows through the second coil; and a tubular-shaped flux concentrator around the first coil and to distort the first field, including a main portion around the first coil and having an inner diameter, first and second ends, a first end portion having an inner diameter smaller than that of the main portion, and a second end portion having an inner diameter smaller than that of the main portion, an inner surface of the flux concentrator defining an annular channel between the first and second end portions, and the first inductor coil being disposed within the annular channel between the first and second end portions.

Provided is a heat treatment apparatus (1), including: a heating unit (2), which is configured to inductively heat a workpiece (W) to a target temperature; and a drive mechanism, which is configured to move a plurality of the coaxially held workpieces (W) relative to the heating unit (2) being in an energized state in an axial direction of the workpiece (W), wherein the heating unit (2) includes: a plurality of coil members (11) respectively including a ring-shaped coil portion (11a) arranged coaxially with the workpiece (W) so as to be capable of surrounding the workpiece (W); and a frame body (21), which is configured to support each of the plurality of coil members (11) so as to be movable in the axial direction of the workpiece while maintaining the coaxial arrangement between the coil portions (11a).

Provided is a heat treatment apparatus (1), including: a heating unit (2), which is configured to inductively heat a workpiece (W) to a target temperature; and a drive mechanism, which is configured to move a plurality of the coaxially held workpieces (W) relative to the heating unit (2) being in an energized state in an axial direction of the workpiece (W), wherein the heating unit (2) includes: a plurality of coil members (11) respectively including a ring-shaped coil portion (11a) arranged coaxially with the workpiece (W) so as to be capable of surrounding the workpiece (W); and a frame body (21), which is configured to support each of the plurality of coil members (11) so as to be movable in the axial direction of the workpiece while maintaining the coaxial arrangement between the coil portions (11a).

A heatsink, a method of manufacturing the heatsink, and an induction welding apparatus including the heatsink. The heatsink includes a carrier sheet and a plurality of tiles. The carrier sheet comprises an electrically non-conductive material and has a contoured profile. The plurality of tiles comprises a thermally conductive and electrically non-conductive material. Each tile of the plurality of tiles has a bonding surface bonded to the carrier sheet and a contact surface opposite the bonding surface. The contact surface is configured to contact a structure to be induction welded.

A device (1) for inductive heating of a workpiece (2) in a rolling mill, the device (1) including: a converter (3) for creating an alternating voltage, a capacitor bank (6) electrically connected to the converter (3), and having a plurality of capacitors (7) connected in parallel, a working field (8), in which an upper coil (10) and a lower coil (11) are arranged. The workpiece (2) is able to be passed between the coils (10, 11) and is thereby inductively heated by cross-field heating. A housing (4) arranged next to, below or above the working field (8). The converter (3) and capacitor bank (6) are arranged in the housing (4). The coils (10, 11) are each electrically connected to the capacitor bank (6) by a flexible cable (12, 13). The cable (12, 13) is a coaxial cable (27), with one phase of the alternating voltage applied to an inner conductor (28) and the other phase of the alternating voltage applied to an outer conductor (29) of the coaxial cable (27). The cables (12, 13) are cooled by a fluid, such as air or water (21).

A device (1) for inductive heating of a workpiece (2) in a rolling mill, the device (1) including: a converter (3) for creating an alternating voltage, a capacitor bank (6) electrically connected to the converter (3), and having a plurality of capacitors (7) connected in parallel, a working field (8), in which an upper coil (10) and a lower coil (11) are arranged. The workpiece (2) is able to be passed between the coils (10, 11) and is thereby inductively heated by cross-field heating. A housing (4) arranged next to, below or above the working field (8). The converter (3) and capacitor bank (6) are arranged in the housing (4). The coils (10, 11) are each electrically connected to the capacitor bank (6) by a flexible cable (12, 13). The cable (12, 13) is a coaxial cable (27), with one phase of the alternating voltage applied to an inner conductor (28) and the other phase of the alternating voltage applied to an outer conductor (29) of the coaxial cable (27). The cables (12, 13) are cooled by a fluid, such as air or water (21).

A coaxially arranged smart susceptor conductor, comprising a smart susceptor core comprising an alloy having a first Curie temperature point and a first smart susceptor shell coaxially arranged around the smart susceptor core. The first smart susceptor shell comprising a second Curie temperature point that is different than the first Curie temperature point of the smart susceptor core. In one arrangement, the second Curie temperature point of the first smart susceptor shell is lower than the first Curie temperature point of the smart susceptor core. In another arrangement, the smart susceptor conductor further comprises a second smart susceptor shell disposed about the first smart susceptor shell. The second smart susceptor shell comprising a third Curie temperature point.

A coaxially arranged smart susceptor conductor, comprising a smart susceptor core comprising an alloy having a first Curie temperature point and a first smart susceptor shell coaxially arranged around the smart susceptor core. The first smart susceptor shell comprising a second Curie temperature point that is different than the first Curie temperature point of the smart susceptor core. In one arrangement, the second Curie temperature point of the first smart susceptor shell is lower than the first Curie temperature point of the smart susceptor core. In another arrangement, the smart susceptor conductor further comprises a second smart susceptor shell disposed about the first smart susceptor shell. The second smart susceptor shell comprising a third Curie temperature point.

Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The processing systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The processing systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The processing systems may include a faceplate heater seated on the faceplate. The faceplate heater may include a first heater coil extending proximate a first area of the faceplate. The faceplate heater may include a second heater coil extending proximate a second area of the faceplate.