H05B6/6491

Apparatus for providing customizable heat zones in an oven
10251223 · 2019-04-02 · ·

An oven may include a cooking chamber configured to receive a food product, a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber; and an energy conversion assembly provided as a cooking surface of the oven. The energy conversion assembly may be configured to convert at least some of the RF energy into thermal energy for heating the food product, while at least some other portion of the RF energy is directly applied to the food product to heat the food product.

CHOKES FOR MICROWAVE DRYERS THAT BLOCK MICROWAVE ENERGY AND ENHANCE THERMAL RADIATION

Systems and methods are provided for chokes for microwave radiation. One embodiment is an apparatus that includes a choke assembly. The assembly includes a first choke plate, and a second choke plate. The assembly also includes a first layer disposed at a surface of the first choke plate. The first layer includes a material that attenuates microwave radiation via dielectric heating by converting the microwave radiation into heat, and a substance, disposed between the material of the first layer and the gap, that is transparent to the microwave radiation. The assembly further includes a second layer disposed at a surface of the second choke plate that faces the first layer. The second layer comprises the material that attenuates the microwave radiation via dielectric heating by converting the microwave radiation into heat, and the substance, disposed between the material of the second layer and the gap.

Chokes for microwave dryers that block microwave energy and enhance thermal radiation

Systems and methods are provided for chokes for microwave radiation. One embodiment is an apparatus that includes a choke assembly. The assembly includes a first choke plate, and a second choke plate. The assembly also includes a first layer disposed at a surface of the first choke plate. The first layer includes a material that attenuates microwave radiation via dielectric heating by converting the microwave radiation into heat, and a substance, disposed between the material of the first layer and the gap, that is transparent to the microwave radiation. The assembly further includes a second layer disposed at a surface of the second choke plate that faces the first layer. The second layer comprises the material that attenuates the microwave radiation via dielectric heating by converting the microwave radiation into heat, and the substance, disposed between the material of the second layer and the gap.

Cooking apparatus and controlling method thereof

Disclosed herein are a cooking apparatus and a controlling method thereof. The cooking apparatus according to one aspect of the present embodiment includes an input part configured to receive a plate warming mode command; a microwave heating part configured to radiate microwave to at least one plate disposed in a cooking chamber provided inside the cooking apparatus; and a control part configured to control at least one of an operation time of the microwave heating part and an intensity of the microwave radiated from the microwave heating part when the plate warming mode command is input.

CRISPNESS AND BROWNING IN FULL FLAT MICROWAVE OVEN

A microwave heating apparatus is disclosed. The heating apparatus comprises a cavity comprising a ceiling and a bottom support plate. The cavity is arranged to receive a food load. The apparatus further comprises at least one microwave supply system configured to supply microwaves at the cavity bottom. The at least one microwave supply system comprises at least one microwave source and at least one antenna arranged below the bottom support plate. The apparatus further comprises a heat element and a crisp plate. The heat element is connected proximate the ceiling and extends substantially over a ceiling area formed by the ceiling. The crisp plate is disposed in the cavity and vertically spaced from the bottom support plate by a rack.

HEATING COOKER
20190045590 · 2019-02-07 ·

The heating cooker includes a first heater disposed below a tray to heat the tray, and second heater disposed over the tray to heat the tray. In addition, the heating cooker includes a controller that controls output of the first heater and switches energization of second heater in accordance with a kind of object to be heated and a quantity of object to be heated. Furthermore, second heater includes two plane-shaped insulators and a plurality of planar heat generators that are sandwiched between insulators, and the controller heats regions that are disposed over and below the tray to be opposed to each other by controlling energization of the first heater and second heater. Furthermore, second heater has a distortion suppressor between the plurality of planar heat generators, and the distortion suppressor suppresses internal distortion of insulators caused by heating of the plurality of planar heat generators of second heater.

A MICROWAVE OVEN WITH DRYING FUNCTION

Embodiments provide a microwave oven comprising a microwave generator, a control unit that controls the microwave generator, a tray produced from a microwave permeable material and whereon foodstuffs such as vegetables and fruits to be dried are placed, and a cavity wherein the tray is placed.

THAWING OF CRYOPRESERVED MATERIALS USING AUTOMATIC SINGLE-MODE ELECTROMAGNETIC RESONANCE

An example method for rewarming a cryopreserved material includes identifying a parameter indicating a state of a container enclosing a single-mode electromagnetic field. The method further includes maintaining the single-mode electromagnetic field by adjusting, based on the parameter, a frequency and/or a power of the electromagnetic waves.

Systems and Methods for Annealing Semiconductor Structures
20180337077 · 2018-11-22 ·

Systems and methods are provided for annealing a semiconductor structure. In one embodiment, the method includes providing an energy-converting structure proximate a semiconductor structure, the energy-converting structure comprising a material having a loss tangent larger than that of the semiconductor structure; providing a heat reflecting structure between the semiconductor structure and the energy-converting structure; and providing microwave radiation to the energy-converting structure and the semiconductor structure. The semiconductor structure may include at least one material selected from the group consisting of boron-doped silicon germanium, silicon phosphide, titanium, nickel, silicon nitride, silicon dioxide, silicon carbide, n-type doped silicon, and aluminum capped silicon carbide. The heat reflecting structure may include a material substantially transparent to microwave radiation and having substantial reflectivity with respect to infrared radiation.

Microwave Furnace For Thermal Processing
20180306512 · 2018-10-25 ·

A furnace system includes a heating chamber, a retort assembly, and a waveguide. The heating chamber includes a shell encompassing an insulation layer and a working volume, where the working volume is configured to receive at least one part for heat treatment. The retort assembly is supported within the insulation layer and includes an inner retort surface facing the working volume. The inner retort surface is formed of at least one carbon compound reflective of microwave radiation, and the retort assembly defines a retort aperture. The waveguide is configured to direct microwave radiation from a microwave source to the retort aperture.