An integrated power control assembly mounted on an axial end of a three-phase motor includes a substrate, two input busbars each of positive and negative polarities alternatively spaced apart on the substrate, a plurality of sets of paired devices, and three output busbars corresponding to the three phases of the motor, wherein a set of paired devices includes a switching semiconductor and a diode. An inner input busbar has edges adjacent to an inner input busbar of opposite polarity and an outer input busbar of opposite polarity and configured to have at least twice as many devices as the outer input busbars. One or more sets of paired devices are disposed axially on outer input busbars and on inner input busbars along the edges. An individual output busbar is disposed over and electrically coupled to one or more sets of paired devices disposed on adjacent input busbars of opposite polarity.

A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.

A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.

The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.

Provided is a display device which has improved heat dissipation efficiency. A display device according to the present invention is provided with a display unit, a circuit board which is positioned in the rear of the display unit, a heat dissipation member which is positioned in the rear of the circuit board and is capable of dissipating the heat of the circuit board, and a case body which contains at least the heat dissipation member. The heat dissipation member has a plurality of heat dissipation pieces which protrude to the outside of the case body through an opening that is provided in the case body, and which extend in the vertical direction, and the opening has an inclined surface, which is inclined upwardly, in a portion that faces the top of each heat dissipation piece.

Provided is a circuit structure having a novel structure with which the dissipation of heat from a heat generating component can be more reliably promoted with a short heat transfer path. A circuit structure includes: a heat generating component; bus bars connected to connection portions of the heat generating component; an insulating base member configured to hold the heat generating component and the bus bars; and a coolant flow path provided inside the base member and through which a coolant flows, the bus bars being in thermal contact with the coolant flow path.

Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

An electric range is provided that may include a case, a cover plate coupled to an upper end of the case and having an upper surface on which a heating target is disposed, and an air guide forming a flow path of air, wherein the air guide includes a element installation portion which is disposed in a portion of the air guide.

A home appliance is provided that may include a first air flow path included in a heat sink, and a second air flow path defined at a lower side of the heat sink, such that air flows to inside and outside of the heat sink efficiently. A plurality of heat dissipation fins may protrude downward from a wall of the second air flow path, increasing a contact surface between the heat sink and air. A projection may be formed on at least one of the walls of the first air flow path, the walls of the second air flow path, an outer surface of the plurality of heat dissipation fins, or an upper surface of the heat sink.

An electric range is provided that may include a case, a cover plate coupled to an upper side of the case and on which an object to be heated is placed, at least one heater that heats the object, the at least one heater being disposed under the cover plate, an upper bracket that is disposed under the at least one heater and supports the at least one heater, a base bracket disposed under the upper bracket and on which a printed circuit board is mounted, a heat sink mounted on the printed circuit board, an air blowing fan that is mounted on the base bracket and discharges air toward the heat sink through an outlet thereof, and an air guide that communicates with the air blowing fan, surrounds the heat sink, and forms a flow path of air cooling the heat sink.