H05K1/0212

CYLINDRICAL HEATER

Provided is a tubular heater whose attachment process is facilitated and whose heating efficiency is high. Features of the tubular heater are that the tubular heater includes a tubular elastic body 200 and a flexible printed circuit board 100 provided integrally with the elastic body 200 and formed with a heating circuit and a heating unit 110 of the flexible printed circuit board 100 formed with the heating circuit is provided in the elastic body 200 in a state in which the heating unit 110 is exposed on an inner peripheral side and extends along an inner peripheral surface of the elastic body 200 with tip ends of the heating unit 110 being separated from each other with a clearance S in a circumferential direction.

LENS HEATER ASSEMBLY
20220043326 · 2022-02-10 ·

In general, one aspect of the subject matter described in this specification can be embodied in an anti-fogging apparatus for a camera assembly. The anti-fogging apparatus includes a camera affixed to a substrate, and a thermally conductive plate, the thermally conductive plate positioned in front of the substrate and defining a first aperture aligned with a lens of the camera. The anti-fogging apparatus includes a transparent plate positioned in front of the thermally conductive plate such that the transparent plate covers said first aperture. The anti-fogging apparatus includes an insulating element positioned in front of the transparent plate and defining a second aperture aligned with the first aperture. The anti-fogging apparatus includes a heating element affixed to the thermally conductive plate. The anti-fogging apparatus includes a case enclosing the camera, the thermally conductive plate, the transparent plate, the insulating element, and the heating element.

LED CHIP INITIAL STRUCTURE, SUBSTRATE STRUCTURE, CHIP TRANSFERRING METHOD AND IMAGE DISPLAY DEVICE
20210320088 · 2021-10-14 ·

An LED chip initial structure, a substrate structure for carrying the LED chip initial structure, a chip transferring method using the LED chip initial structure, and an LED image display device manufactured by the LED chip transferring method are provided. The LED chip initial structure includes an LED chip main body and a conductive electrode. One of a top side and a bottom side of the LED chip main body is a temporary electrodeless side, another one of the top side and the bottom side of the LED chip main body is a connecting electrode side, and the temporary electrodeless side has an unoccupied surface. The conductive electrode is disposed on the connecting electrode side of the LED chip main body so as to electrically connect to the LED chip main body. The LED chip initial structure is adhered to a hot-melt material through the conductive electrode.

Thermal substrate with high-resistance magnification and positive temperature coefficient

A printed circuit that comprises a substrate, electrical interconnects and a double-resin ink having a positive temperature coefficient (PTC), wherein the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius. The substrate is a fabric or mesh, while the double-resin ink and the electrical interconnects are deposited onto the substrate.

Circuit assembly

A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.

Relay arrangement with improved heat dissipation and converter device having a relay arrangement of this kind

A relay arrangement includes at least two series-connected relays, which are mechanically and electrically connected to a main printed circuit board via first terminals and second terminals, and at least one flat conductor for conducting current between the at least two series connected relays. The flat conductor is mechanically connected to the main printed circuit board and electrically and thermally connected to the first terminals of the relays, and the at least one flat conductor is configured to dissipate heat produced during operation of the relays.

Heater For Apparatus For Detecting Molecule(s)
20210283614 · 2021-09-16 ·

A heater (22) for heating a substantially transparent or translucent cover of a reaction vessel. The heater has a board (80) having a front face, an opposing back face, and an aperture (1062) through which an excitation beam can pass into a reaction vessel via a cover of the reaction vessel, and/or through which reaction light can pass from the reaction vessel via the cover. A thermally conductive, heat-spreading layer (86) radiates heat towards the cover, the heat-spreading layer being arranged on the front face of the board that is arranged to face the cover. At least one heating element outputs heat to the heat-spreading layer (86), the heating element being arranged on the back face of the board that is arranged to face away from the cover. The heat-spreading layer (86) is in thermal communication with the heating element by at least one heating via 82 through the board.

CIRCUIT BOARD ASSEMBLY

Provided is a circuit board assembly including an electronic component that generates heat, and a thermistor that is mounted on a circuit board that is spaced apart from the electronic component and that detects the temperature of the electronic component. The circuit board assembly further includes a heat conductive pattern formed surrounding the thermistor, and a heat conductive member that conducts heat from the electronic component to the heat conductive pattern.

HEATER INCLUDING FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
20210307155 · 2021-09-30 · ·

A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.

HEATER HAVING FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
20210307118 · 2021-09-30 · ·

Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.