An electromagnetic array includes a substrate defined by a plurality of regions. Each region includes a plurality of conductors arranged in a varying configuration such that, upon application of an electric current, each conductor of the plurality of conductors generates a magnetic field in a polarity that is other than a polarity of a corresponding magnetic field of at least one adjacent conductor. Each region includes a first surface and a second surface opposite the first surface, the first surface having a strong magnetic field relative to a weak magnetic field associated with the second surface in response to the electric current. A first region is adjacent to another region, and configured such that a polarity of the strong magnetic field associated with the first region is in a polarity other than a polarity of the strong magnetic field associated with the at least one other region.

A system to provide induction heating includes a welding-type power supply to apply an electric current, a first electromagnetic array formed on a first substrate and a second electromagnetic array formed on a second substrate. Each array includes a plurality of conductors arranged in a varying configuration such that, upon application of the electric current, each conductor of the plurality of conductors generates a magnetic field in a polarity that is other than a polarity of a corresponding magnetic field of at least one adjacent conductor. A first surface and a second surface opposite the first surface, the first surface having a strong magnetic field relative to a weak magnetic field associated with the second surface in response to the electric current.

Systems and methods for a printed circuit board assembly comprising a thermoelectric device at least partially embedded within the printed circuit board assembly are provided. The thermoelectric device is configured to adjust a temperature of the printed circuit board assembly based on the measurements of one or more sensors coupled to the printed circuit board assembly. Additionally, a control circuit is coupled to the at least one thermoelectric device and the one or more sensors, wherein the control circuit is configured to control the at least one thermoelectric device, and wherein the control circuit is configured to monitor a temperature set point at one or more target locations in the printed circuit board assembly.

An electronic component embedded substrate includes a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer; an electronic component disposed in the first cavity; a first insulating material covering at least a portion of the electronic component; a first wiring layer disposed on the first insulating material and connected to the electronic component; a built-in block disposed in the second cavity; and a second insulating material covering at least a portion of the built-in block.

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius.

A printed circuit that comprises a substrate, electrical interconnects and a double-resin ink having a positive temperature coefficient (PTC), wherein the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature T and a resistance of the double-resin ink at 25 degrees Celsius. The substrate is a fabric or mesh, while the double-resin ink and the electrical interconnects are deposited onto the substrate.

A system for reducing low cycle fatigue of a soldered connection includes a controller and a heating element operatively connected to the controller. The system also includes a printed wire board soldered in connection with an electronic component. The controller is configured to retrieve a signal indicative of a temperature of the electronic component, and compare the temperature to a stored predetermined range of operating temperatures. Responsive to determining that the temperature of the electronic component is less than a lower threshold temperature of the predetermined range of operating temperatures, the controller transmits a signal to the heating element that causes the heating element to heat the electronic component. The controller then saves, to an operatively connected computer readable memory, a magnitude of temperature difference and a number of times that magnitude is reached. The controller uses the stored information to track the life of the electronic component.

An apparatus is provided which comprises: a processor die; a processor substrate having a region extended away from the processor die, wherein the processor die is mounted on the processor substrate, wherein the extended region has at least one signal interface which is connectable to a top-side connector; and an interposer coupled to the processor substrate and a motherboard.

A vehicular antenna device includes an antenna portion having an antenna element, and a frame accommodating a heat generation member. The vehicular antenna device is configured to be attached to an attachment portion of a vehicle. The frame includes a first space portion having a cylindrical shape and defining a first space, the first space portion being exposed to an outside air in a condition where the vehicular antenna device is attached to the vehicle. The heat generation member is located along a second surface of the frame that is a reverse side of a first surface defining the first space. The antenna portion is detachable from the frame.

An optical device comprises a printed circuit board (PCB) comprising an image capture electronic circuit, a lens holder and a heating element. The lens holder extends along the optical axis of the optical device from its top to bottom extremities and comprises a top optical element arranged on its top extremity. The lens holder is mounted on the PCB so as to align, along the optical axis, the image capture electronic circuit and the top optical element. The heating element comprises a heating part arranged in contact with the top optical element and first and second electrical conductive wires. Each wire extends from the heating part to their bottom extremity which is directly attached in electrical contact with the PCB. The optical device also comprises first and second wire insertion guide elements. The first and second wires are respectively arranged in the first and second guide elements.