A memory heater and heating air arrangement includes circuit module including circuit board, a plurality of memory modules mounted at the circuit board, memory heat sink wrapped around each memory module and locating member mounted at the circuit board around the memory modules, heating aid including flat heat-transfer base panel bonded to top side of the memory heat sinks, mounting structure located at the border of the flat heat-transfer panel and affixed to the locating member to secure the heating aid to the circuit module, and a heater attached to a top surface of the flat heat-transfer base panel of the heating aid and controllable by the circuit module to emit heat to the memory modules via the heating aid, enabling the memory modules to work under a cold environment. Subject to the functioning of the heating aid, one single heater is sufficient to heat the memories, saving the cost.

A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.

A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.

A display device includes a display panel including a top surface and a bottom surface facing the top surface in a normal direction, a mold member including a seat surface and an outer surface, the bottom surface of the display panel being positioned on the seat surface of the mold member, an adhesion member between the bottom surface and the seat surface to fix the bottom surface to the seat surface, a heating wire contacting the adhesion member, and an accommodation member coupled to the mold member.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

A board-like structure includes a base body, an internal conductor, a connection conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The connection conductor is connected to the internal conductor inside the base body. The terminal member is connected to the connection conductor inside the base body and is exposed to an external portion of the base body at the lower surface. The connection conductor is longer in length in a vertical direction than a thickness of the internal conductor in the vertical direction. In the terminal member, at least a side surface is connected to the side surface of the connection conductor.

Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.

A nano graphene platelet-based conductive ink comprising: (a) nano graphene platelets (preferably un-oxidized or pristine graphene), and (b) a liquid medium in which the nano graphene platelets are dispersed, wherein the nano graphene platelets occupy a proportion of at least 0.001% by volume based on the total ink volume and a process using the same. The ink can also contain a binder or matrix material and/or a surfactant. The ink may further comprise other fillers, such as carbon nanotubes, carbon nano-fibers, metal nano particles, carbon black, conductive organic species, etc. The graphene platelets preferably have an average thickness no greater than 10 nm and more preferably no greater than 1 nm. These inks can be printed to form a range of electrically or thermally conductive components or printed electronic components.

A lithium-ion battery assembly configured to provide electric power to a vehicle. The battery assembly includes a plurality of battery cells interconnected to provide a combined electrical potential between positive and negative terminals of the battery assembly, and a printed circuit board assembly (PCBA) disposed adjacent to a first array of battery cells of the plurality of battery cells. The PCBA includes a collector plate electrically coupled with the first array of battery cells, a temperature sensor configured to obtain temperature readings, a plurality of heaters configured to generate heat using electrical power, and an assembly processor. The assembly processor is configured to obtain readings from the temperature sensor, determine an estimated battery cell temperature, and initiate a heating program by delivering electrical power to the plurality of heaters from an electrical power source when the estimated battery cell temperature is below a threshold.

The present disclosure relates to optical systems, vehicles, and methods for providing improved thermal images. An example optical system includes a housing, a thermal camera disposed inside the housing, and an optical window coupled to an opening of the housing. The optical system also includes a heater assembly. The heater assembly includes a window heater and at least one connector extending from the window heater. The window heater is thermally coupled to an inner surface of the optical window. The window heater is configured to maintain the optical window at a desired temperature.