A power converter includes a housing including a convex radiator that radiates heat from a heater element and protrudes toward a board, in which the board and the heater element are arranged, and an urging member that is arranged between the board and a bottom surface of the housing and urges the heater element toward a first side surface of the convex radiator of the housing.

The disclosure provides an apparatus, system and method of providing a flexible heater on at least one conformable substrate of a medical fluid bag. The disclosed embodiments may include providing a matched function ink set, printed onto at least one substantially planar face of the at least one substrate to form at least: at least one conductive layer capable of receiving current flow from at least one power source; at least one resistive layer electrically associated with the at least one conductive layer and comprising a plurality of heating elements capable of generating heat upon receipt of the current flow; and at least one dielectric layer capable of at least partially insulating the at least one resistive layer.

A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.

An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device with an electric power generation function, which can prevent the circuit board from increasing in size.

MEANS TO SOLVE THE PROBLEM: A semiconductor integrated circuit device 200 with an electric power generation function has a semiconductor integrated circuit device and a thermoelectric element 1. The semiconductor integrated circuit device includes a package 210 to house a semiconductor integrated circuit chip 230. The semiconductor integrated circuit chip 230 has a lower surface opposing the circuit board and an upper surface opposing the mounting surface. The thermoelectric element 1 includes a casing unit having a housing unit, a first electrode unit provided inside the housing unit, a second electrode unit provided inside the housing unit, separated from and opposing the first electrode unit in the first direction, and having a work function different from that of the first electrode unit, and a middle unit provided between the first electrode unit and the second electrode unit, and including a nanoparticle having a work function between the work function of the first electrode unit and the work function of the second electrode unit, in the housing unit. The casing unit is provided inside a circuit board 260.

A medical device comprising a multilayer printed circuit board (PCB) comprising a heating element on an inner layer of the PCB; a single cell electrical power source to power the heating element; and a chamber adapted to contain a liquid, at least part of said chamber being defined by a thermally conductive material configured to provide a thermal transfer interface between the chamber and the PCB.

A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.

A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

In general, one aspect of the subject matter described in this specification can be embodied in an anti-fogging apparatus for a camera assembly. The anti-fogging apparatus includes a camera affixed to a substrate, and a thermally conductive plate, the thermally conductive plate positioned in front of the substrate and defining a first aperture aligned with a lens of the camera. The anti-fogging apparatus includes a transparent plate positioned in front of the thermally conductive plate such that the transparent plate covers said first aperture. The anti-fogging apparatus includes an insulating element positioned in front of the transparent plate and defining a second aperture aligned with the first aperture. The anti-fogging apparatus includes a heating element affixed to the thermally conductive plate. The anti-fogging apparatus includes a case enclosing the camera, the thermally conductive plate, the transparent plate, the insulating element, and the heating element.

A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.