An electric motor includes a plurality of SMD components arranged on a carrier of the motor, and a connection part for the SMD components together with an electrically conductive housing part of the motor. A contact spring electrically connects a plurality of SMD components to the housing part. The contact spring has a main section, a spring-type connection section that extends outwards from one side of the main section, and at least one spring-type contact section that extends outwards from the other side of the main section. The spring-type connection section of the contact spring includes a plurality of contact fingers for the SMD components.

According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer. The circuit substrate comprises: a ground area made of a conductor formed at least one of the first board layer, the second board layer, or the at least one third board layer and electrically connected to the conductive shell through the capacitor while being connected to a ground portion of the electronic device; a first conductive area which is a partial area of the first board layer facing the connector, the first conductive area being made of a conductor having a first size and electrically connected to the conductive shell; and a second conductive area which is an area of the second board layer at least partially facing the first conductive area with the at least one third substrate layer interposed therebetween, the second conductive area being made of a conductor having a second size wider than the first size and electrically connected to the first conductive area. At least one of the first conductive area and the second conductive area may be arranged adjacent to the ground area such that the first conductive area and the second conductive area are electrically separated from the ground area.

A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissipation section 4a that is provided so that a part thereof is exposed to a side surface of the wiring substrate 2. In this case, because the heat dissipation section 4a is provided so that a part thereof is exposed to the side surface of the wiring substrate 2, the heat from the electronic component 3a can be dissipated through the side surface of the wiring substrate 2.

An electronic device includes first and second housings rotatably coupled with each other through a hinge, thereby being in a folded state or an unfolded state. The electronic device further includes first and second printed circuit boards (PCBs) disposed in the first and second housings, respectively, and at least one wiring member electrically connecting the first and second PCBs. The electronic device further includes a window disposed over the first and second housings and the hinge, and a display disposed under the window. The display includes a display panel extending in the first housing and having a first FPCB electrically connected to a ground of the first PCB. The display includes a polymer member, a first conductive member disposed in the first housing and electrically connected to the first FPCB, and a second conductive member disposed in the second housing. The electronic device further includes a supporting member disposed between the second conductive member and the second PCB in the second housing. The second conductive member is electrically connected to the second PCB through a conductive region of the supporting member and electrically connected to the ground of the first PCB through the wiring member.

A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member. The shielded printed wiring board of the present invention includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; a connecting member including a metal foil and a conductive filler fixed to the metal foil with an adhesive resin; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the electromagnetic wave shielding film is arranged on the substrate film in such a manner that the insulating layer of the electromagnetic wave shielding film is located on the shielding layer of the electromagnetic wave shielding film, the connecting member is arranged on the electromagnetic wave shielding film in such a manner that the conductive filler of the connecting member penetrates the insulating layer of the electromagnetic wave shielding film and that the conductive filler of the connecting member is in contact with the shielding layer of the electromagnetic wave shielding film, the reinforcing member is arranged on the electromagnetic wave shielding film and the connecting member in such a manner that the conductive adhesive layer of the reinforcing member is in contact with the insulating layer of the electromagnetic wave shielding film and the metal foil of the connecting member, and the ground circuit of the substrate film is electrically connected to the metal reinforcing plate of the reinforcing member.

A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.

Audio device, electronic circuit, and related methods, in particular a method of manufacturing an electronic circuit for an audio device is disclosed, the method comprising providing a circuit board; mounting one or more electronic components including a first electronic component on the circuit board; applying a first insulation layer outside the first electronic component; and applying a first shielding layer outside the first insulation layer.

A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.

A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.

An interposer substrate includes a metal member; and a connection substrate disposed on at least portion of one side surface of the metal member. The connection substrate includes circuit patterns exposed from each of one surface of the connection substrate and the other surface of the connection substrate opposing the one surface, and one of a plurality of side surfaces of the connection substrate connecting one side and the other side of the connection substrate is attached to at least a portion of the one side surface of the metal member.