An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

The module includes a substrate, a first component mounted on a first surface, a first sealing resin, and a first shield film. When viewed in a cross section taken along a plane perpendicular to the first surface, the substrate is formed with a step portion. The substrate includes a first extraction electrode disposed to be exposed to the step portion. The first extraction electrode is connected to a first shield film. The first shield film includes one or more thick portions having a film thickness greater than that of the other portions in the step portion.

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film.

An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

The present disclosure provides an electromagnetic shielding film, a flexible circuit board and a display device. The electromagnetic shielding film includes a central portion and an edge portion. The central portion has a plurality of surrounding side edges; and the edge portion is provided on at least one side edge of the central portion, and includes a plurality of protruding units protruding away from the central portion. The plurality of protruding units are arranged in an extending direction of the side edge where the edge portion is located. The electromagnetic shielding film is used to attach on a flexible circuit board body, the central portion is located on a non-bending area, and the edge portion is located on a bending area, so that the flexible circuit board is formed.

Protecting qubits of a quantum processor from spontaneous emission and thermal photon noise includes connecting a first port of a filter to a signal line of a readout resonator of a qubit circuit of a quantum processor. The filter has a passband including a readout resonator frequency associated with the readout resonator and a first stopband including a qubit transition frequency associated with the qubit circuit. A second port of the filter is connected to a measurement device. a signal line of the filter is galvanically connected to a reference ground in thermal contact to a stage of a cryostat. The galvanic connection further makes a thermal connection to an input signal line of the qubit circuit.

Feed forward compensation of parasitic capacitance in a device frontend is provided. A feed forward element is positioned along at least a portion of a length of a first input resistance and a distance away from the first input resistance. In some implementations, the feed forward element has a width that is increasing along the at least a portion of the length of the first input resistance. The feed forward element is operative to introduce an element capacitance that offsets a parasitic capacitance in a volume surrounding the first input resistance.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.