Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 10.sup.10Ω, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 10.sup.6Ω.

An electro-optical panel including a display region includes a first terminal group including a plurality of first terminals arranged along a first side of a liquid crystal panel; and a second terminal group disposed between the first terminal group and the display region and including a plurality of second terminals arranged along the first side, in which the number of the plurality of second terminals is smaller than the number of the plurality of first terminals.

A printed circuit board includes a body, a first conductive pattern layer disposed on a first surface of the body, and a second conductive pattern layer disposed on a second surface of the body. The first conductive pattern layer and the second conductive pattern layer form a capacitor. The present disclosure further provides an motor having the printed circuit board.

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.

A printed circuit board (PCB), electronic assembly, and method are provided. A PCB adapted to receive a radio frequency (RF) chip includes one or more features that extend through at least a portion of the depth of the PCB. The features are filled with an RF absorber composite comprising a binder and an RF absorber material. The features are positioned in the PCB to reduce RF signal coupling between the RF chip and one or more metal surfaces of the PCB.

A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

An electronic component module includes an electronic component, a resin structure, a wiring portion, and a shield portion. The resin structure covers a second main surface and at least a portion of a side surface of the electronic component. The wiring portion is electrically connected to the electronic component. The shield portion includes a first conductor layer and a second conductor layer. The first conductor layer is spaced away from the electronic component between the electronic component and the resin structure, and has electrical conductivity. The second conductor layer is spaced away from the wiring portion between the wiring portion and the resin structure, and has electrical conductivity. In the shield portion, the first conductor layer and the second conductor layer are integrated.

In an electronic device having a compact form factor, such as a head mounted display device, flexible printed circuits may be utilized to provide interconnects between EMI-generating peripheral components and other components in the device such as those populated on main circuit boards. Coverlays utilized to protect circuit traces and ground planes in the flexible printed circuits are configured with openings that can expose ground planes at various locations throughout the electronic device. Electrical pathways are formed by conductive foam, conductive adhesives, and/or other conductive materials between the exposed ground planes and a device ground to establish multiple ground loops throughout the device that shunt EMI energy that is generated by electronic components and circuits during device operation. The coverlay openings can be positioned on the flexible printed circuits so that the lengths of the ground loops are minimized to enhance overall EMI emission management performance.

Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.