One general aspect of the present disclosure includes an electrical circuit with a circuit carrier, at least one electrical component arranged on the circuit carrier, and at least one data transmission device with an antenna section. The data transmission device may be configured for wireless transmission of data and may include a housing, where the at least one electrical component, the at least one data transmission device, and at least one section of the circuit carrier are at least partially enclosed by the housing. At least the antenna section of the data transmission device may be arranged in a transmission range inside the housing and the transmission range may be spaced at a distance from the circuit carrier.

A method of manufacturing a component carrier, includes providing a base structure having a main surface that is at least partially covered by a component fixation structure; providing a component, the component intrinsically comprising warpage; mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; and fixating the component to the component carrier through the component fixation structure.

An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer.

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.

An electronic component mounting board includes: a circuit board having a wiring layer; a pocket part provided on a main surface of one side of the circuit board; a passive component housed in the pocket part; an active component arranged above the passive component and the main surface of the one side of the circuit board and connected to the passive component; and a shield layer formed of a material containing a magnetic material and provided between a bottom surface of the pocket part and a lower surface of the passive component.

A display device includes a TFT substrate including an overlap portion overlapping the color filter substrate and a non-overlap portion which does not overlap the color filter substrate; a color filter substrate; a source driver; and a height adjusting body. A color filter surface of the color filter substrate is opposite a surface facing a first major surface of the TFT substrate at a first distance. The source driver is disposed on the non-overlap portion and has a source driver surface that is opposite a surface facing the first major surface and disposed a second distance from the first major surface, which is less than the first distance. The height adjusting body is disposed on the non-overlap portion and has a height adjusting body surface opposite a surface facing the first major surface disposed a third distance from the first major surface, which is greater than the second distance.

Disclosed herein is an electrostatic capacitance input device including: an input region of a substrate, in which a plurality of input position detection electrodes are provided; a plurality of wires that are electrically connected to the plurality of input position detection electrodes and extend outside the input region of the substrate; and a shield electrode that overlaps the wires on the input operation side.

An electronic apparatus includes an antenna device, a circuit board, and a housing containing the antenna device and the circuit board. The inner surface of the housing is spaced apart from the circuit board. The antenna device includes an antenna unit, a matching circuit unit connected to the antenna unit, a transmission line unit connected to the matching circuit unit, and a connecting portion included in the transmission line unit. The antenna device is disposed along the inner surface of the housing. The connecting portion is connected to a circuit of the circuit board. The antenna device includes a ground connection portion in the matching circuit unit in a region where the antenna device is disposed along the inner surface of the housing. The ground connection portion electrically connects a second ground conductor of the antenna device to a first ground conductor on the housing.

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

Provided is an electronic equipment which can effectively reduce unexpected unnecessary radiation. In the electronic equipment, a circuit board on which a noise source that is an electronic part becoming a source of the unnecessary radiation is mounted and a circuit board mounting plate on which the circuit board is mounted are disposed substantially parallel with a space put therebetween. In the electronic equipment, a partition plate is disposed, which functions as a noise reflecting surface on which an indirect wave emitted from the noise source towards the circuit board mounting plate is reflected. Further, an indirect wave dispersing member is disposed between the circuit board and the circuit board mounting plate so as to block spacing between the noise source and the partition plate.