Leakage of radio-frequency radiation noise radiated from a noise source to the outside is suppressed. An electronic control device 1 includes a printed board 101 having signal grounds 104a, 104b, and 104c, and a frame ground 103a, a housing 100 accommodating the printed board 101, and a connector 105 mounted on the printed board 101. The electronic control device 1 includes a first coupling portion 301 that AC-couples the signal ground 104a with the frame ground 103a and a second coupling portion 301 that electrically couples the frame ground 103a with the housing 100, and the first coupling portion 301 and the second coupling portion 301 are provided between the connector 105 and an electronic circuit 110 on the printed board 101.

A module includes: a substrate having a first face; a plurality of components mounted on the first face; a resin film that covers the plurality of components along contours of the plurality of components and also covers a part of the first face; and a shield film formed to overlap the resin film. The first face is provided with a ground electrode. The resin film has an opening, and the shield film is connected to the ground electrode via the opening.

A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

An electronic device including a shield structure is provided. The electronic device includes a first device including a first magnetic substance, a second device including a second magnetic substance, and a shield structure configured to shield at least part of a magnetic force generated between the first magnetic substance and the second magnetic substance, wherein the shield structure includes a shield member disposed between the first device and the second device and including a property of a magnetic substance, and a connecting member physically connected to at least part of the shield member and including a property of a nonmagnetic substance, wherein at least part of the connecting member is physically connected to a circuit board.

In general aspect, a module can include a substrate having a semiconductor circuit implemented thereon, and a negative power supply terminal electrically coupled with the semiconductor circuit via the substrate. The negative power supply terminal includes a connection tab arranged in a first plane. The module also includes a first positive power supply terminal electrically and a second positive power supply terminal that are coupled with the semiconductor circuit via the substrate. The first positive power supply terminal being laterally disposed from the negative power supply terminal, and including a connection tab arranged in the first plane. The second positive power supply terminal is laterally disposed from the negative power supply terminal and arranged in the first plane, such that the negative power supply terminal is disposed between the first positive power supply terminal and the second positive power supply terminal.

According to an embodiment disclosed in the specification, an electronic device comprises a battery disposed inside the electronic device; a printed circuit board (PCB) disposed inside the electronic device; at least one electronic component disposed on the PCB; and a first buck converter having a first end and a second end, wherein the first end is routed to the battery; and a second buck converter having a first end and a second end, wherein the first end is selectively electrically connected to the second end of the first buck converter, and the second end is routed to the at least one electronic component, and wherein the first buck converter and the second buck converter are configured to boost a voltage provided from the battery through an electrical path formed from the battery by the first end of the first buck converter, and the second end of the first buck converter, the first end of the second buck converter and the second end of the second buck converter to the at least one electronic component.

According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.

A circuit structure includes a circuit board, microstrips, a stripline, and vias. The circuit board includes conductive levels. A first and second transceiving circuits are disposed on a first conductive level. A first microstrip is disposed on the first conductive level, and configured to couple a first pin of the first transceiving circuit to a second pin of the second transceiving circuit. A second and third microstrips are disposed on the first conductive level, and coupled to a third pin of the first transceiving circuit and a fourth pin of the second transceiving circuit, respectively. The stripline is disposed on a second conductive level. A first and second vias cross the first and second levels, and couple the second and third microstrips to the stripline. The first and third pins are an inner and outer pins of a front line of a BGA of the first transceiving circuit, respectively.

An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.