A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.

Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

Provided are a display device and a manufacturing method thereof. The display device includes a display assembly, an antenna, and a feed circuit board. At least part of the antenna is disposed on the side of the light emission surface of the display assembly. The antenna includes a radiator and a first feed structure connected to the radiator. The feed circuit board is disposed on the side of the display assembly facing away from the light emission surface. The feed circuit board includes a power division network and a second feed structure connected to the power division network. The first feed structure at least partially overlaps the second feed structure along the thickness direction of the display assembly.

A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.

Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.

A circuit board includes a magnetic shielding member having a first principal surface, and a second principal surface on an opposite side from the first principal surface, and a flexible wiring board having a first surface, and a second surface on an opposite side from the first surface. The second surface of the flexible wiring board is fixed to the first principal surface and the second principal surface of the magnetic shielding member. The first surface of the flexible wiring board includes a circuit area mounted with an electronic component, and one or more terminal areas where connection terminals are disposed. The circuit area is disposed above the first principal surface of the magnetic shielding member. The circuit board has a bent shape bent along the magnetic shielding member, so that the one or more terminal areas are disposed below the second principal surface of the magnetic shielding member.

An antenna assembly includes a base, a modem, a top lid and a housing. The base is composed of an aluminum material. The modem is disposed on the base. The top lid is for the base, and the top lid includes at least one antenna element disposed on an exterior surface. The housing covers the top lid and base. The top lid acts as an electro-magnetic barrier for the modem.

An extensible and contractible wiring board includes first and second extensible and contractible wiring substrates formed by respective wiring at extensible and contractible substrates. Each of the first and second extensible and contractible wiring substrates has a first end having functional units and an intermediate wiring portion, with the wiring and the functional units of the first and second extensible and contractible wiring substrates not electrically connected. Moreover, the first and second extensible and contractible wiring substrates are electrically independent extensible and contractible wiring substrates, and the wirings and the functional units do not overlap at the first ends of the first and second extensible and contractible wiring substrates in top view of the extensible and contractible wiring board, and the intermediate wiring portions of the first and second extensible and contractible wiring substrates overlap in top view of the extensible and contractible wiring board.

A detonator module provides for the use of a wide range of different addressable switches for use in perforating guns. The detonator module permits pre-assembly of a desired addressable switch and conforms the electrical connectivity to a particular perforating gun. In this manner, nearly any addressable switch can be used from any manufacturer despite having different sizes or wiring layouts. The pre-assembled detonator module can be safely shipped due to a safety shunt that can be removed on site prior to installation into a perforating gun. In one sense, the detonator module permits conformance of multiple different types of addressable switches to a particular type or model of perforating gun, permitting flexible choice of addressable switch for a particular project.