A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.

[Problem] Objects of the invention are to provide a cable assembly with reduced characteristic impedance at a protruding end portion of a first wire of a cable and configured for easy manufacture, and to provide a method for manufacturing the cable assembly.

[Configuration] A cable assembly A1 includes a terminal 400a, a cable 100, and an electroconductive member 200. The cable 100 includes an outer insulator 100, a shield conductor 120 inside the outer insulator 110, and at least one first wire 130a being a signal wire inside the shield conductor 120. The first wire 130a includes a protruding portion Pa protruding in the Y-Y′ direction from the shield conductor 120 and the outer insulator 110. The electroconductive member 200 is an electroconductive plate or electroconductive tape wound around at least a part in the Y-Y′ direction of the protruding portion Pa.

A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

A broadband transition coupling for transition between a waveguide and a printed circuit board with a substrate integrated waveguide is disclosed. The broadband transition coupling comprises a main body that encompasses an air-filled waveguide section and a transition section. The air-filled waveguide section comprises a first interface for the waveguide. The transition section provides a second interface for the printed circuit board. The transition section continuously tapers along the second interface in order to reduce a height of the transition section for transition coupling with the printed circuit board. Further, the present disclosure relates to a broadband system for processing electromagnetic signals.

A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are electrically connected to the first bridge end and the second bridge end, respectively; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion for a first functional wiring line on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively. The wiring layout of the flexible printed circuit is simple and is easy to be manufactured.

Provided is a touch screen and a terminal. The touch screen includes a touch layer, a conducting layer and a substrate layer which are laminated and matched in sequence, wherein an antenna radiating body, and an antenna signal line and a ground feeder line which are connected with the antenna radiating body are arranged on the conducting layer. The terminal includes the touch screen.

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.

A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.