Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.

An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board.

Systems and methods herein include features for compensating a temperature reading of a thermostat. The thermostat may include a housing and one or more temperature sensors within the housing. The thermostat may sense a temperature using one or more of the temperature sensors. A processor and/or memory of the thermostat may be capable of and/or configured to compensate the sensed temperature with a first temperature compensation model and compensate the sensed temperature with a second temperature compensation model. During compensation of the sensed temperature, the system may transition from compensating the sensed temperature with the first temperature compensation model to compensating the sensed temperature with the second temperature compensation model over time and independent of the sensed temperature.

An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for receiving at least part of the display, where the display holder may extend adjacent part of the front side of the display and adjacent at least part of the side walls of the display. The PCB may be secured relative to the display holder and adjacent the back side of the display. The PCB may be in operative communication with the display. In some cases, a spacer may be situated between the back side of the display and the PCB.

A device includes a printed circuit board (PCB). The device may also include a high voltage coil disposed on the PCB and a low voltage coil disposed on the PCB. Further, a conductive shield forms a three-dimensional enclosure around the high voltage coil and confines an electric field generated by the device to the PCB.

An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for receiving at least part of the display, where the display holder may extend adjacent part of the front side of the display and adjacent at least part of the side walls of the display. The PCB may be secured relative to the display holder and adjacent the back side of the display. The PCB may be in operative communication with the display. In some cases, a spacer may be situated between the back side of the display and the PCB.

An electrical power conversion system for converting a high voltage from a HV electrical power supply to a low voltage is disclosed. In an embodiment, the electrical power conversion system includes at least one power converter and at least one RC network including a plurality of resistive components and a plurality of capacitive components electrically connected in series. In an embodiment, the at least one RC network is in series connection with the at least one power converter and the at least one RC network and at least one power converter are arranged to be connected across a line potential of the HV electrical power supply.

Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

An intrinsically safe mobile device having a form factor, speed, and functionality comparable to a conventional non-intrinsically safe mobile device, includes non-intrinsically safe electronic components mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device, the non-intrinsically safe electronic components are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe, wherein the encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling, wherein the trace and the FPC cabling are certified as intrinsically safe using one or more protection techniques chosen from a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, and maintaining a minimum clearance space.

A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a magnetic core including at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein the carrier board unit includes at least one via hole, at least one primary winding and at least one secondary winding; and wherein the at least one core column passes through the via hole of the carrier board unit, the pin is provided at one side of at least one of the carrier board units close to the system board and configured to connect the carrier board units with the system board.