An integrated circuit die has a peripheral edge and a seal ring extending along the peripheral edge and surrounding a functional integrated circuit area. A test logic circuit located within the functional integrated circuit area generates a serial input data signal for application to a first end of a sensing conductive wire line extending around the seal ring between the seal ring and the peripheral edge of the integrated circuit die. Propagation of the serial input data signal along the sensing conductive wire line produces a serial output data signal at a second end of the sensing conductive wire line. The test logic circuit compares data patterns of the serial input data signal and serial output data signal to detect damage at the peripheral edge of the integrated circuit die.

A printed circuit board for high-power components includes at least two dielectric layers. A thermally-conductive embedded layer is disposed between two of the dielectric layers and includes one or more internal coolant channels. Thermal vias extend from the embedded layer to an exterior surface of at least one of the dielectric layers. At least one of the dielectric layers in the printed circuit board has an exterior surface on which one or more high power components may be mounted. In some implementations, there are at least two dielectric layers on a same side of the embedded layer and high power components may be located inside the printed circuit board between two dielectric layers. Thermal resistance between the high-power components and the embedded layer is decreased in comparison to typical surface-mounted cold plates, resulting in more efficient heat dissipation. In some implementations the embedded layer is also an electrical ground plane.

A high voltage power supply is disclosed. The high voltage power supply comprises a primary winding and one or more secondary windings. In one embodiment, a single secondary winding is used and the high voltage doubler circuit comprises a capacitor string and a diode string. In another embodiment, a plurality of secondary windings are used and the high voltage doubler circuit comprises a plurality of low voltage doubler circuits arranged in series. To create a more uniform distribution of voltage across the capacitors in the high voltage doubler circuit, one or more shields are disposed on the printed circuit board. In certain embodiments, a high voltage shield is disposed at the high voltage output and a low voltage shield is disposed at the low voltage end of the high voltage doubler circuit. One or more intermediate shields may be disposed in the high voltage doubler circuit.

Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

A current control module is employed to protect a conductive feature of a printed circuit board (PCB) from an overcurrent event by comparing a reference voltage output from a compensation circuit connected to a reference power supply to a voltage output from a conductive feature connected to a power supply which is different from the reference power supply. The reference output voltage is representative of an anticipated voltage output from the conductive feature. The current control module is configured to initiate regulation of power to the conductive feature when the voltage output from the conductive feature exceeds the reference voltage output.

A power substrate (101) of the present invention includes a plurality of insulating substrates (106) arranged side by side along a plurality of current paths (P) extending in the same direction, a plurality of MOS transistors (108) mounted on one major surface of each of the plurality of insulating substrates (106) with a first conductive layer (107) and a first solder bonding layer (109) in between, and a heat dissipation member (110) in contact with other major surfaces of all of the insulating substrates with a second conductive layer (107) and a second solder bonding layer (109) in between, and each of the current paths (P) is formed by connecting one or more of the MOS transistors (108) mounted on one of the insulating substrates (106) with one or more of the MOS transistors (108) mounted on a different one of the insulating substrates (106) in series with each other.

The present disclosure provides a trace detection device. The trace detection device includes: a box body comprising a main body frame and a top plate, the top plate and the main body frame forming a fully enclosed cavity; an ion migration tube assembly in the cavity and on a first side of the cavity; and a preamplifier and high voltage circuit board in the cavity and on a second side of the cavity, the second side being opposite to the first side.

The present disclosure provides a battery module comprising a circuit board, the circuit board comprises a conductive layer, a first pad and a second pad. The conductive layer is formed with a sampling circuit, the sampling circuit comprises: a sampling end portion; an outputting end portion; a first branch path formed with a first fusing zone; and a second branch path formed with a second fusing zone. The first pad is provided on the sampling end portion, the second pad is provided on the second branch path. When the first fusing zone is fused, the circuit board can be quickly repaired by means of the second branch path and the second pad to electrically connect the sampling end portion and the outputting end portion, thereby achieving the purpose of reusing the circuit board, therefore the entire battery module is not scrapped and the utilization of the battery module is improved.

Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

A protection relay connection assembly (10) for connecting a current transformer (14) and/or a voltage transformer (16) of an electrical network (12) to a protection relay (18) is provided. The protection relay connection assembly (10) includes a protection relay data acquisition board (20) and a protection relay connector (22). The protection relay data acquisition board (20) includes a first current mating member (24) connectable to a current measurement sensor (28), the current measurement sensor (28) being connectable in use to the protection relay (18) and/or a first voltage mating member (26) connectable to a voltage measurement sensor (30), the voltage measurement sensor (30) being connectable in use to the protection relay (18). The protection relay connector (22) includes a second current mating member (36) connectable to the current transformer (14) and/or a second voltage mating member (38) connectable to the voltage transformer (16). The first current mating member (24) and the second current mating member (36) are selectively mateable with one another to permit a measured current waveform of the electrical network (12) to be transmitted from the current transformer (14) to the protection relay (18). The first voltage mating member (26) and the second voltage mating member (38) are shaped to be selectively mateable with one another to permit a measured voltage waveform of the electrical network (12) to be transmitted from the voltage transformer (16) to the protection relay (18). Wherein the first current mating member (24) is shaped to prevent mating of the first current mating member (24) with the second voltage mating member (38), and the first voltage mating member (26) is shaped to prevent mating of the first voltage mating member (26) with the second current mating member (36).