A method and apparatus for arranging fuses in a printed circuit board includes a power input configured to connect to a power source, at least one electrical component connected to the power input, a first output connected to the at least one electrical component and configured to connect to a load, and a fuse disposed between the at least one electrical component and the first output, and having a first trip rating.

Provided is a power conversion device with which a region in which an electronic component is mountable in a first printed wiring board of a first substrate can be enlarged. The power conversion device includes a power module installing member, a power module, a bus bar assembly, a first substrate provided on the bus bar assembly, and a second substrate provided on the bus bar assembly. The first substrate includes a first printed wiring board, and a signal terminal connector and a first board-to-board connection connector which are each provided on the first printed wiring board. The second substrate includes a second printed wiring board and a second board-to-board connection connector provided on the second printed wiring board. The signal terminal connector is connected to a signal terminal of the power module. The first board-to-board connection connector and the second board-to-board connection connector are connected to each other.

Provided are a motor drive device that reduces the likelihood of mounting error during manufacture, and a method for manufacturing the same. The motor drive device is provided with: a substrate; a first mounting region for mounting first circuit component; a second mounting region for mounting a second circuit component; a first pair of connection points for connecting a first connecting wire member, constituting a first path for supplying electric current to the first circuit component, onto the substrate such that at least a part of the first connecting wire member overlaps the second mounting region; and a second pair of connection points for connecting second connecting wire member, constituting a second path for supplying electric current to the second circuit component, onto the substrate such that at least a part of the second connecting wire member overlaps the first mounting region.

A battery module includes a lower housing and a plurality of battery cells. The plurality of battery cells are electrically coupled together to produce a voltage. The module also includes an assembly disposed over the battery cells and coupled to the lower housing. The assembly may include a lid and a plurality of bus bar interconnects mounted on the lid. The module also includes a printed circuit board (PCB) assembly disposed on and coupled to the assembly. The PCB assembly may include a PCB. The module also includes a cover disposed over and coupled to the lower housing to hermetically seal the battery module. Also disclosed is a method of manufacturing the battery module.

A cell-contacting system for a battery module having an array of a plurality of battery cells. Cell connectors connect the cell terminals of the battery cells. The signal lines of a printed circuit board connect a signal source of one of the cell connectors to a signal management circuit or a connection interface. A plastics material carrier plate fits onto the battery cell array and has a first receiving region for the printed circuit board and a plurality of second receiving regions for one each of the plurality of cell connectors. The carrier plate has a base plate and frame elements for receiving the printed circuit board and the cell connectors. Snap-action hooks on the frame elements allow the printed circuit board or the cell connectors to be snap-fit into the corresponding receiving regions.

A semiconductor device, including a substrate having an insulating plate and a conductive plate formed on the insulating plate, a semiconductor chip formed on the conductive plate, a contact part arranged on the conductive plate with a bonding member therebetween, a rod-shaped external connection terminal having a lower end portion thereof fitted into the contact part, and a lid plate having a front surface and a back surface facing the substrate. An insertion hole pierces the lid plate, forming an entrance and exit respectively on the back and front surfaces of the lid plate. The external connection terminal is inserted in the insertion hole. The semiconductor device has at least one of a guide portion with an inclined surface, fixed to a portion of the external connection terminal located in the insertion hole, or an inclined inner wall of the insertion hole.

A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a power device embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the power device and configured to distribute a load current switched by the power device. A fourth metal layer is positioned between the second metal layer and the power device and configured as a primary thermal conduction path for heat generated by the power device during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.

A circuit structure includes a first busbar constituted by a cladding material, a second busbar, an insulating member including an insulating portion located between the first busbar and the second busbar, and an electronic component provided on the first busbar and the second busbar so as to straddle the insulating portion. The electronic component has a connection terminal bonded to the first busbar.

An inverter power assembly includes: a mounting frame; a power module mounted on the mounting frame; and a capacitor electrically connected to the power module. The inverter power assembly has the power module mounted on the mounting frame and the capacitor electrically connected to the power module, which leads to a simple and compact structure and a reasonable arrangement for the entire inverter power assembly.

A current sensor assembly includes a housing; a plurality of shields which are accommodated inside the housing and open toward the top of the housing; a plurality of bus bars to which three-phase current is applied and which are arranged spaced apart from each other so as to go past the plurality of shields, respectively; and a current sensor unit which includes a printed circuit board and a plurality of current sensors disposed on the printed circuit board to measure the current applied to the bus bars. The shields, the bus bars, and the current sensor unit are configured to be accommodated inside the housing, and the current sensors are spaced apart from the bus bars and disposed in the inner spaces of the shields.