Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.

A power commutation module includes a printed circuit board, a first plate-shaped bus bar, and a first plurality of power switches each including a plurality of connection pins which are connected on the upper face of the printed circuit board and a metal base plate which is applied against the bus bar. The first plurality of power switches is mounted on the first bus bar. The power switches are generally aligned along a longitudinal edge of the first bus bar, in that said longitudinal edge of the first bus bar is arranged along a first longitudinal edge of the printed circuit board, and the portion of the first bus bar on which the power switches are mounted is arranged next to the printed circuit board.

An electromagnetic component for a circuit board includes first and second magnetic core pieces and a bifilar coil extending between the first and second magnetic core pieces. The bifilar coil includes a first coil segment having first and second surface mount terminations, and a second coil segment having third and fourth surface mount terminations. The bifilar coil and core pieces facilitate a significant height reduction in the component while offering the same performance as existing power inductor components.

According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.

A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.

In an embodiment, a smart connector includes an Application Specific Electronics Packaging (ASEP) device formed by an ASEP manufacturing process, and a separate printed circuit board electrically connected to electrical components of the ASEP device. The ASEP manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of ASEP devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

A noise filter includes: a first bus bar that is electrical wiring of a flat plate, the first bus bar including a first extending wiring portion extending in a first direction, a second extending wiring portion extending in a second direction that is a direction opposite to the first direction, and a first coupling wiring portion connecting the first extending wiring portion and the second extending wiring portion; a first lead conductor having a first end connected with the first coupling wiring portion; a first capacitor having a first end connected with a second end of the first lead conductor and a second end connected with a ground; and a magnetic core having an opening in a central portion, the magnetic core disposed in such a manner that the first coupling wiring portion passes through the opening.

A filter inductor for high-current applications. The filter inductor includes a magnetic core and a winding. The winding includes a shaped section having opposing ends, a pair of arm sections laterally extending from the opposing ends of the shaped section, respectively, and a pair of inductor pins, each extending perpendicular from an end of a respective arm section. The magnetic core includes a first core portion and a second core portion. The first core portion includes a recessed channel configured to receive the shaped section of the winding. The second core portion includes a pair of recessed regions configured to receive the pair of arm sections of the winding, respectively. The first core portion and the second core portion are coupled in contact to one another to secure the shaped section of the winding within the magnetic core. The filter inductor can be edge-mounted to a printed circuit board.

A printed circuit board includes a high voltage section, a high current conductor which is arranged in the high voltage section, and a low voltage section which is separated from the high voltage section. For this purpose, the low voltage section has shielding layers which shield the low voltage section from the high voltage section. A signal processing device is embedded between the shielding layers.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.