A device that includes a printed circuit board (PCB), a metal conductor, and a transistor. The metal conductor includes first and second oppositely facing surfaces. The transistor includes first and second terminals between which current is transmitted when the transistor is activated, and a gate terminal for controlling the transistor. The first terminal is sintered to the first surface, and the gate is electrically connected to a trace on the PCB.

A smart plug that is partitioned into a plurality of printed circuit boards (PCBs) in a three dimensional manner to reduce its size. Aspects consider the effect of the possible increased internal temperature as the size of the smart plug is reduced. For example, thick metal foils connect various components of a smart plug to reduce heat dissipation within the smart plug. Also, a metal foil may transfer heat from contact metal on a PCB to a side wall of a plastic housing of the smart plug. The smart plug may comprise a computing device that obtains information identifying the attached electrical device and accesses device data about the time duration during which the attached electrical device exhibits transient characteristics. The computing device then uses the accessed data to effectively control the attached electrical device.

A control board of a power conversion device, the control board includes a board main body, a plurality of drive circuits, a power source control circuit, an insulation region, a plurality of insulation transformers, and a connecting line that electrically connects the plurality of insulation transformers and the power source control circuit to each other, and at least a part of which extends in a region in inner layers of the board main body that overlaps the insulation region when viewed in a perpendicular direction with respect to the surface of the board main body.

The present subject matter relates to a battery module for use in a vehicle. The battery module may include a housing, a plurality of battery cells disposed within the housing, and solid state pre-charge control circuitry that pre-charges a direct current (DC) bus that may be coupled between the battery module and an electronic component of the vehicle. Furthermore, the solid state pre-charge control circuitry may include solid state electronic components as well as passive electronic components.

A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

A power contacting device includes a contact pin (1) and at least one contact pin receptacle (2) penetrated by the contact pin in the operating state. To provide a power contact which permanently ensures high-quality contacting, even when the contacted components move relative to one another, the contact pin receptacle (2) has a first guide arrangement (3) which is fixed to a component in the operating state and a second guide arrangement (4) which is conductively connected to the first guide arrangement, the second guide arrangement (4) being arranged displaceably on the first guide arrangement (3) and the contact pin (1) conductively contacting at least the second guide arrangement (4) in the operating state.

It is presented an inverter type motor drive device for feeding three phase AC electric power to an electric motor, the inverter type motor drive device comprising: an insulated metal substrate board on which, for each of the three phases, a plurality of power switches are mounted in straight lines in switch assemblies along a first direction; a printed circuit board on which a plurality of capacitors are mounted; and two DC power input terminals. The inverter type motor drive device further comprises three AC power output terminals, each extending through the printed circuit board while avoiding galvanic contact with the printed circuit board, and each of the three AC power output terminals comprise an elongated AC busbar, wherein a longitudinal direction of the AC busbar extends along the first direction.

An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.

A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.

A semiconductor device includes an insulating substrate including an insulating plate and a circuit plate disposed on a main surface of the insulating plate; a semiconductor chip having a front surface provided with an electrode and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate and including a metal layer; a conductive post having one end electrically and mechanically connected to the electrode and another end electrically and mechanically connected to the metal layer; a passive element fixed to the printed circuit board; and a plurality of positioning posts fixed to the printed circuit board to position the passive element.