A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate having at least one electric element mounted on one surface thereof and including a plastic material having heat dissipation and insulation properties; and at least one bus bar electrically connected to the electric element and partially embedded in the support plate. Due to these features, since heat generated from the bus bar and the electric element is dissipated to the outside through the support plate, it is possible to prevent performance deterioration due to heat and breakage of electronic components.

A battery module includes a housing, a plurality of battery cells disposed in the housing, and a printed circuit board (PCB) assembly disposed in the housing. The PCB assembly includes a PCB and a shunt disposed across a first surface of the PCB. A second surface of the shunt directly contacts the first surface of the PCB, and the shunt is electrically coupled between the battery cells and a terminal of the battery module.

The invention has for object an electrical assembly comprising: a first electrical connection bar, a second electrical connection bar, and an electronic card,
the first and the second electrical connection bar being in electrical contact with one another, on a connection zone, said card being at a distance from said connection zone. The assembly further comprises an electrical conduction part that creates an electrical connection between said connection zone and the electronic card.

An assembly includes at least three layers of sheet metal lying directly on top of one another and joined in a stack of sheet metal. The layers of sheet metal are each joined in pairs by a clinching joint. At least one layer of sheet metal arranged between one of the pairs of layers of sheet metal joined by the clinching joint and an outer side of the stack each have an access opening aligned with the clinching joint.

The present disclosure relates to an electrostatic shield for providing electrostatic shielding for a current sensing coil. Current sensing coils are configured to enable the measurement of a current carried by an electrical conductor passing through a core of the current sensing coil. The electrostatic shield of the present disclosure is configured to provide electrostatic shielding to a core of the current sensing coil in order to reduce or eliminate electrostatic coupling between the electrical conductor and the current sensing coil, thereby improving the accuracy of current measurement that may be achieved by the current sensing coil.

A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.

An electrical assembly includes a circuit board, a shunt busbar; a connector including a first conductive resilient member and a second conductive resilient member, and a controller. The first conductive resilient member and the second conductive resilient member may be disposed substantially between the circuit board and the shunt busbar. The first conductive resilient member and the second conductive resilient member may electrically connect the controller with the shunt busbar.

A circuit assembly that includes a plurality of FETs that include source terminals and gate terminals. The circuit assembly includes a substrate portion to which the source terminals and the gate terminals are connected, and through-holes that are formed in the substrate portion for each FET and pass through the substrate portion in the thickness direction thereof.

A connection module includes a FPC and bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other. The FPC includes a first wiring portion, a second bus bar mount portion, and a third bus bar mount portion to which the bus bars are connected. The FPC further includes a second expandable/contractable portion and a third expandable/contractable portion. The second expandable/contractable portion is continuous from the second bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the first wiring portion and the third bus bar mount portion. The third expandable/contractable portion is continuous from the third bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the second bus bar mount portion.