H05K1/0268

System and method for electrical circuit monitoring

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.

Multilayer circuit board used for probe card and probe card including multilayer circuit board

A multilayer circuit board 3a includes a core substrate 7; a resin section 8, which covers the side surface and a lower surface 12 of the core substrate 7; and a plurality of metal pins 11, which are disposed within the resin section 8. The core substrate 7 includes a ceramic multilayer section 9, which is disposed on the mother-substrate side of the core substrate 7; and a resin multilayer section 10, which is stacked on a main surface 13 on a side of the ceramic multilayer section 9, the side being opposite to the mother substrate. The resin section 8 includes the plurality of metal pins 11, and a through-hole 22, which extends through the resin section 8 in its thickness direction. A fastening part 24 penetrates the through-hole 22, to mount the multilayer circuit board 3a on the mother substrate.

Printed circuit board with a bent connecting section and method for testing and producing said printed circuit board, and also electronic control unit and method for operating said electronic control unit
11067622 · 2021-07-20 · ·

A method for testing a printed circuit board includes providing a printed circuit board having a first main section, a second main section, a bent connecting section and at least one monitoring conductor track. The connecting section is disposed between the first main section and the second main section. The monitoring conductor track runs from the first main section, in a curved manner through the connecting section, to the second main section. At least one electrical measurement value which is representative of the integrity of the at least one monitoring conductor track is detected. A printed circuit board, a control unit and methods for producing the printed circuit board and for operating the control unit are also provided.

Circuit Board

The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

Method for manufacturing multilayer wiring board

Provided is a method of manufacturing a multilayer wiring board, in which electrical inspection can be performed with accurate probing while warpage of a multilayer laminate is reduced. This method includes providing a laminated sheet including a first support, a first release layer and a metal layer; alternately stacking wiring layers and insulating layers on a surface of the metal layer, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad; bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween such that at least a part of the n-th connection pad is disposed within the opening; releasing the first support from the reinforced multilayer laminate at the first release layer; and putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection.

Display device and method for checking display device
11069267 · 2021-07-20 · ·

A display device includes: a display panel; a main wiring board; a first wiring board that includes a first feedback line; and a first cable that is removably coupled to the main wiring board and the first wiring board. The main wiring board includes: a first output line; a first input line; a first circuit (a power supply circuit) that outputs a first voltage to the first output line; and a control circuit that is connected with the first input line. The first cable includes: a first forward conductor that directly or indirectly connects the first output line and the first feedback line; and a first return conductor that directly or indirectly connects the first input line and the first feedback line. The control circuit determines whether the first voltage is input, and when an input of the first voltage is determined, starts a display on the display panel.

DISPLAY DEVICE AND FILM PACKAGE
20210259108 · 2021-08-19 · ·

A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

REDISTRIBUTION PLATE
20210243896 · 2021-08-05 ·

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

Contactor For Testing Electronic Device
20210239733 · 2021-08-05 ·

An electronic device having a structure that electrically connects the contactor to an electronic device during a testing process is disclosed. The contactor includes a holder for accommodating the electronic device during the testing process; a flexible circuit, having a first set of contacts electrically connected to the corresponding electrode terminals of the electronic device, and a second set of contacts electrically connected to a control unit that sends test signals during the test process; an elastomer, for adjusting the pressure between the first set of contacts of the flexible circuit and the corresponding electrode terminals of the electronic device while being pressed together; and an alignment tool, for aligning the first set of contacts with the corresponding electrode terminals of the electronic device. The electrode terminals of the electronic device are located on the same surface of the electronic device and the flexible circuit is detachable from the contactor.

WIRING SUBSTRATE AND CURRENT MEASURING DEVICE
20210243886 · 2021-08-05 ·

A wiring substrate includes an insulating body; a first conductor including a first shield layer provided in a first layer inside the insulating body, and a second shield layer provided in a second layer at a different position from the first layer in a thickness direction of the insulating body; a second conductor including a first guard layer provided in a third layer positioned between the first layer and the second layer in the thickness direction, and a second guard layer provided in a fourth layer positioned between the second layer and the third layer in the thickness direction; and a third conductor provided in a fifth layer positioned between the third layer and the fourth layer in the thickness direction.