A technique to characterize moisture in a dielectric layer of a printed circuit board is provided. A method comprises applying a test signal to test circuitry comprising a test capacitor that is formed with the dielectric layer of the printed circuit board; measuring at least one characteristic of a least one of signal transmission and signal reflection from the test circuitry; and determining, from the at least one measured characteristic, at least one parameter value indicative of moisture content in the dielectric layer.

A circuit structure and a fabrication method thereof are provided. The fabrication method of the circuit structure includes the following steps: providing a substrate; fabricating a test circuit component on the substrate; fabricating a solder pad on the test circuit component; fabricating an insulating layer; and fabricating a conductive pad on the insulating layer. A second surface of the insulating layer covers the test circuit component and the solder pad. The conductive pad is coupled to the solder pad. Through the fabrication method of the circuit structure provided by the disclosure, circuit quality of the circuit structure may be monitored, and that reliability of the circuit structure provided by the disclosure is improved.

A measurement system is provided, including a measurement machine and a computer. The measurement machine is configured to measure a thickness T1 of a to-be-tested circuit board and a drilling depth D1 of the to-be-tested circuit board. The computer calculates a length S1 of a residual conductive portion in a back drilled hole of the to-be-tested circuit board according to a thickness T of a reference circuit board, a drilling depth D of the reference circuit board, a length S of a residual conductive portion in a back drilled hole of the reference circuit board, the thickness T1 of the to-be-tested circuit board and the drilling depth D1 of the to-be-tested circuit board.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

The disclosure relates to the technical field of backlight structures, and discloses a backlight source and a display device. The backlight source includes a light bar and a metal frame; the side, containing the light bar, of the metal frame has a notch; the light bar includes a light-emitting unit; the light-emitting unit includes a plurality of light-emitting groups; each light-emitting group includes at least one first light-emitting group and at least one second light-emitting group, the first light-emitting group includes N light-emitting elements, the light-emitting element numbered n is connected in series with the light-emitting element numbered n+1 successively, the light-emitting element numbered 1 and the light-emitting element numbered N are arranged adjacently, and the light-emitting element numbered 1 and the light-emitting element numbered 2 are the farthest apart.

A method of positioning a component arranged on a substrate includes providing a substrate having at least one device for sensing an electromagnetic field arranged thereat, generating a dedicated conductive-trace structure on the substrate, the dedicated conductive-trace structure being provided for the purpose of generating an electromagnetic field having a known field distribution, applying an electric voltage to the dedicated conductive-trace structure, so that the dedicated conductive-trace structure generates the electromagnetic field having the known field distribution, and sensing the generated electromagnetic field having the known field distribution by means of the device for sensing an electromagnetic field. According to the method, the location of the component in relation to the substrate is determined on the basis of the above-mentioned sensing of the electromagnetic field having the known field distribution.

A control device for a motor vehicle is provided. The control device includes a printed circuit board having a first side and an edge. The first side of the printed circuit board is delimited by the edge. The control device includes at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board). The control device also includes a first conductor loop formed as a resistor and arranged on the first side of the printed circuit board. The first conductor loop is arranged between the edge and the electronic component. The control device also includes an encapsulation of the printed circuit board. The encapsulation surrounds at least the first side, the at least one electronic component and the first conductor loop.

A control unit for a motor vehicle is provided. The control unit includes a printed circuit board having a first side and an edge. The first side is delimited by the edge. At least one electronic component is arranged on the first side of the printed circuit board and is electrically conductively connected to the printed circuit board. At least one first conductor loop is arranged on the first side of the printed circuit board and at least one second conductor loop is arranged at a distance from the first conductor loop. The first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component. An encapsulation surrounds at least the first side, the at least one electronic component, the first conductor loop and the second conductor loop.

Instruction classification and software intrusion detection is performed. Program instruction execution of a processor of a microcontroller unit (MCU) is monitored via side-channel signal analysis, the monitoring including capturing a signal trace of a physical property of the MCU that leaks information correlated with the program instruction execution of the MCU, the signal trace indicating a value of the physical property over time. From the signal trace, time domain features, frequency domain features, and Mel Frequency Cepstral Coefficients (MFCC) features are extracted. A model is utilized for instruction detection to identify an execution signature based on the time domain features, frequency domain features, and MFCC features. The execution signature is compared to one or more reference instruction signatures. A remedial action is performed responsive to the execution signature failing to match to the one or more reference instruction signatures.

Provided is a printed circuit board for degradation detection, the printed circuit board having an insulator substrate and a wiring pattern for degradation detection, the wiring pattern being formed on an outer surface of the insulator substrate, and the printed circuit board for degradation detection being attached to a main printed circuit board for which degradation is to be detected. The wiring pattern is formed on, of the outer surfaces of the insulator substrate, a back surface positioned on the main printed circuit board side. The insulator substrate has a penetrating part (through hole, notch part) penetrating from the back surface to a front surface positioned on the side opposite from the back surface.