A stencil printer for printing an assembly material on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly being configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The stencil printer further comprises a verification system to determine whether an item placed within the stencil printer is properly installed within the stencil printer.

An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together; and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.

The invention relates to a marking device (02) for marking circuit boards (04) tested by means of a test device (01, 08), wherein the marking device (02) can be fixed to the test device (01, 08) in a defined target position, and wherein the marking device (02) has a marking member (06) which can engage the surface (05) of a circuit board (04), and wherein the marking member (06) can be driven by a drive mechanism (16) in order to apply a marking to the surface (05) of the circuit board (04) by an operating movement of the marking member (06) depending on the test result. The marking device (02) includes a fixation module (10) and a quick change module (11), wherein the marking device (02) can be fixed to the test device (01, 08) in the defined target position by means of the fixation module (10), and wherein the quick change module (11) includes the marking member (06) and the drive mechanism (16), and wherein the quick change module (11) can be replaced without removing the fixation module (10).

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

A grid clustering-based system for locating abnormal area of solder paste printing and a method thereof are disclosed. In the system, an analysis device divides circuit board size information to generate divided grids based on grid size information, when a total number of at least one bad solder joint of one of the divided grids is determined to be higher than or equal to a density threshold value, the analysis device sets the one of divided grids as a high dense grid, the analysis device then integrates the divided grids, which are high dense grids and interconnected to each other, as a high-dense bad solder joint area. Therefore, the technical effect of integrating high dense areas of bad solder joint to locate the bad solder joint can be achieved.

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

An electronic apparatus includes a display panel including a base substrate including an active area and a peripheral area adjacent to the active area, pixels on the active area, pads on the peripheral area and arranged in a first direction, signal lines connecting the pixels to the pads, and a vernier mark on the peripheral area and spaced apart from the pads and the signal lines, a circuit board on the display panel and including a base film, and leads on the base film and overlapping with the pads in a plan view, and a conductive adhesive member extending in the first direction and between the display panel and the circuit board to connect the pads to the leads. The conductive adhesive member overlaps with the vernier mark when viewed in a second direction intersecting the first direction.

An organic light emitting diode (OLED) display device is provided. The OLED display device includes a display panel and a camera. A first alignment mark is formed on a low pixel density area of the display panel, a second alignment mark is formed in the camera, and arrangements of the first alignment mark and the second alignment mark are consistent. Therefore, an alignment accuracy between the camera and the display panel is improved, and a purpose of adopting a blind hole in the area where the camera is mounted on the display device and displaying normally is achieved.