Example methods, apparatus, systems for droplet actuator fabrication are disclosed. An example non-transitory computer readable medium includes instructions that, when executed, cause at least one processor to at least control movement of a laser to cause the laser to etch an electrode pattern in a first substrate, the electrode pattern including a first set of electrodes, a second set of electrodes, and a third set of electrodes; control a printer driver to cause a hydrophobic material and a dielectric material to be applied to the second set of electrodes and not the first set of electrodes via a printer; control a bonding driver to cause a gap to be defined between the first substrate and a second substrate; and control a dicing driver to cause a portion the first substrate and a portion of the second substrate to be cut into a droplet actuator.

Example methods, apparatus, systems for droplet actuator fabrication are disclosed. An example method disclosed herein for making a droplet actuator includes ablating a first substrate with a laser to form an electrode array on the first substrate. The example method includes applying at least one of hydrophobic or a dielectric material to the electrode array. The example method also includes aligning the first substrate with a second substrate. The second substrate includes a second treated layer. In the example method, the alignment includes a gap between at least a portion of the first treated layer and at least a portion the second treated layer.

The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as printed circuit board A), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as printed circuit hoard B), printed circuit board B being equipped with at least one electronic component with specific requirements (19), mid the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 300). The composite primed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20). A fastening side (15) of the at least one printed circuit board B rests flat on a contact face (21) of the heat sink (20), the contact face (21) of the heat sink (20) being dimensioned and positioned such that at least part of a extends laterally beyond the fastening side (15) of the at least one printed circuit board B in each case towards the end regions (10) formed. Supporting elements (23, 24, 23, 26) are formed on the contact face (21) of the treat sink for the mechanical support of the end regions (16). The invention also relates to a method for producing such an electronic module.

A display device includes a display unit including transistors disposed in a display area and signal lines arranged in a non-display area located along an edge of the display area, at least one of the signal lines being electrically connected to the transistors; and an input sensing unit disposed over the display unit and including sensing electrodes disposed on the display area, sensing lines arranged on the non-display area, and a first dummy pattern disposed on the non-display area and spaced apart from the sensing electrodes as compared with the sensing line, wherein the first dummy pattern overlaps a first signal line of the signal lines, the first signal line being spaced farthest from the display area, a planar shape of an overlap pattern formed by overlapping the first dummy pattern and the first signal line coincides with a planar shape of an alignment mark.

A component carrier related body which includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures, and at least two information carrying structures formed vertically displaced on at least two different of the layer structures, wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack.

Disclosed herein is a system for drilling in a multilayer printed circuit board. The system includes a source of electromagnetic radiation configured to transmit a measurement pulse in open air to a workpiece, an anode, a resettable electric charge sensor (ECS), operably connected to the anode, and a control unit, configured to receive at least one value indicative of the quantity of at least part of charged molecules received at the anode and determine a second value indicative of the quantity of charged molecules received at the anode that were derivative of emitted electrons responsive to the measurement pulse.

A high speed multi-directional 3D printer includes two opposing delta 3D printers set in an opposing configuration, a modified frame to enable both delta 3D printers to slide back and forth, two horizontal/outward printing extruders, and a sliding/locking kernel substrate mount with adhesive for printing against gravity.

A land (22) and a wiring pattern (25a) are formed on a component mounting surface (3A) of a circuit board (3), and the wiring pattern (25a) is covered with a solder resist layer (26). An electrode part (21c) of an aluminum electrolytic capacitor (21) is soldered to the land (22) via a solder (27). An intermediate film (24a) formed of a part of a silk pattern (24) is printed on the solder resist layer (26), and by a thermosetting adhesive (23), the aluminum electrolytic capacitor (21) is bonded to the intermediate bonding film (24a). By the intermediate bonding film (24a), the stress of the adhesive (23) at the time of thermal shrinking is relaxed.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

A method for machining a holding device for a light module of a lighting device of a motor vehicle. An SMD semiconductor light source component arranged on the holding device is operated for light generation. An emission characteristic of a light-emitting surface of the SMD semiconductor light source component is determined. A mechanical feature with regard to the holding device is specified depending upon the emission characteristic. An optical element which co-operates optically with the SMD semiconductor light source component is specified depending upon the mechanical feature with regard to the SMD semiconductor light source component.