In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.

The present disclosure is a printed circuit board on which a connector to connect with a flexible flat cable or a flexible printed circuit board is mounted. The printed circuit board including a receiving port at which the connector receives the flexible flat cable or the flexible printed circuit board; and an opening that is disposed between an end of the printed circuit board facing the receiving port of the connector and a position corresponding to at least one of end portions of the receiving port.

In a component mounter, a cut and clinch unit is arranged below a circuit board that is conveyed by a conveyance device, and the cut and clinch unit can be moved to a given position by a moving device. When imaging a fiducial mark of the circuit board using an imaging device, the cut and clinch unit is moved such that an identification assistance sticker arranged on the cut and clinch unit is positioned as the background to the fiducial mark. The color of the circuit board surrounding the fiducial is white and the color of the identification assistance sticker is black. Thus, the outline of the fiducial mark is clear and the fiducial mark can be appropriately recognized based on the image data.

A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.

A packaging system comprises: a package forming a set of discrete compartments; and a film portion interfacing with the package. The film portion includes a set of one or more electrically conductive traces in which each electrically conductive trace is associated with a respective compartment of the set of discrete compartments. Each electrically conductive trace of the set of electrically conductive traces forms a respective circuit loop that has a terminal end that terminates within an interface region of the film portion to collectively form a termination pattern. At least one of the package or the film portion have two or more alignment ports defined therein that are arranged according to an alignment pattern, each alignment port passing through at least one of the package or film portion.

The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.

An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

Disclosed is an apparatus for fabricating a stretchable electrical circuit, including: a stretching device configured to stretch a mounted stretchable substrate in two different directions; a marking device configured to mark a mark on the stretchable substrate; an image device configured to obtain an image of the stretchable substrate on which a plurality of alignment marks are marked by the marking device; and a control device configured to control the stretching device, the image device, and the marking device. The control device forms a first axis and a second axis using the plurality of alignment marks marked on the image obtained by the image device and marks one point of a surface of the stretchable substrate with coordinates made by the first axis and the second axis using the first axis and the second axis.

LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.