An opto-electric hybrid board is provided, which includes an electric circuit board including an electric wiring provided on a front surface of an insulation layer, an optical waveguide provided on a back side of the electric circuit board, and an outline processing alignment mark positioned adjacent to an outline processing portion on the front surface of the insulation layer on the same basis as the electric wiring, and has an outline formed by performing an outline processing operation with reference to the outline processing alignment mark . The opto-electric hybrid board has an accurate outline and, therefore, can be attached to other component without an engagement failure or a connection failure.

A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrate base; and at least one alignment mark disposed on the surface of the substrate base to be spaced apart from the ball lands and exposed to the outside, wherein top surfaces of the ball lands and a top surface of the at least one alignment mark are at substantially the same vertical level and the ball lands and the at least one alignment mark include the same material.

An inspection system for and method of inspecting deposits printed on workpieces through a printing screen, the system comprising: a camera unit movable relative to a printing screen, where comprising a body including a plurality of apertures, and a workpiece on which deposits are printed through the apertures of the printing screen; and a control unit operable to control the camera unit such as to capture images of at least one pair of corresponding regions of the printing screen and the workpiece, and process the images to determine, for each of a plurality of points defining the image of the printing screen, whether the point is of aperture, and, only where the point is of aperture, determine whether the corresponding point of the corresponding image of the workpiece, as defined by a corresponding plurality of points, is of deposit, thereby enabling a determination of a print characteristic of deposits printed on the workpiece from a relationship of the points determined to be of deposit to the points determined to be of aperture.

An optoelectronic component includes a carrier having an upper side which includes a first subarea and a second subarea, wherein the first subarea and the second subarea have different optical properties, and a method of producing an optoelectronic component includes providing a carrier having an upper side which includes a first subarea and a second subarea, and changing an optical property in the first subarea or in the second subarea.

A display device includes: a panel substrate configured to display an image; a control printed circuit board to receive an image signal from an external source, to generate data and a control signal based on the image signal, and to provide the data and the control signal to the panel substrate; and a flexible printed circuit board (FPCB) electrically connected to the panel substrate and electrically connected to the control printed circuit board. A first align mark is disposed on the FPCB and a second align mark is disposed on the control printed circuit board.

A printed wiring board includes a primary circuit that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit that is used when a low voltage component used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source are provided; a pattern for a common circuit that is used when a high voltage component used for the high voltage and the low voltage that insulates the pattern for the primary circuit from the pattern for the common circuit; a first insulator which insulates the pattern of the primary circuit from the pattern of the common circuit; and a second insulator that insulates the pattern for the common circuit from the pattern for the low voltage circuit.

The present invention provides a COF structure, which comprises a thin-film body, two or more driving chip, bonding wires, and bonding marks. The two or more driving chips are disposed on the same thin-film body, to generate driving signals. The bonding wires are disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips The bonding marks are disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.

A circuit module includes a circuit board and electronic components mounted on the circuit board. The mounted electronic components include at least one discrimination-target electronic component and at least one module-discrimination electronic component. In addition, the circuit board includes land electrodes allowing the module-discrimination electronic component to be mounted at different positions and/or orientations with respect to the circuit board, and the module-discrimination electronic component is mounted at any one position and/or orientation among different positions and/or orientations with respect to the circuit board in accordance with the type of the discrimination-target electronic component.

A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.