An apparatus includes a printed circuit board (PCB) that includes a woven glass laminate layer. The woven glass laminate layer includes a plurality of glass bundles woven together, where a marker structure including at least one marker is defined within the woven glass laminate layer. A security chip is coupled with the PCB and includes memory that stores an authentication identifier of the PCB, where the authentication ID includes a representation of the marker structure.

The first and second electronic components are mounted on a printed circuit board. A temperature indicating resin comes in contact with not the second electronic component but the first electronic component. The temperature indicating resin visually changes upon increase in the temperature. Alternatively, an electronic component is mounted on the printed circuit board. The temperature indicating resin comes in contact with not the electronic component but the printed circuit board. The temperature indicating resin visually changes upon increase in the temperature.

A fiducial mark allocation method including: allocating at least two fiducial marks out of three or more fiducial marks provided on a board to a component to be used for calculating a correction amount of a mounting position of the component on the board; determining whether the mounting position of the component is within a range defined by the fiducial marks in an X direction, a Y direction, or both the X direction and the Y direction, wherein the allocating of the at least two fiducial marks is performed based on whether the mounting position of the component is within a range defined by the fiducial marks in the X direction, the Y direction, or both the X direction and the Y direction.

The display device comprises a first base portion including display and non-display areas and a pad area, and a printed circuit film attached to the pad area of the first base portion, wherein pad electrodes on the first base portion and a first panel alignment mark on one side of the plurality of pad electrodes are disposed in the pad area, a first protective layer is on the pad electrodes, and a first open portion that exposes a portion of an upper surface of each pad electrode is defined in the protective layer, the printed circuit film includes a third base portion and lead electrodes on a lower surface of the third base portion and connected to the pad electrodes, and the first panel alignment mark includes a first panel alignment metal portion and a second open portion and surrounded by the first panel alignment metal portion on a plane.

A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.

A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

A circuit board structure for a display device includes a substrate, a bump, a protective layer, and a moisture-resistant layer. The substrate includes a first surface and a second surface opposite to the first surface. The bump is disposed on the first surface of the substrate and includes a first inorganic material. The protective layer is disposed on the first surface of the substrate. The protective layer includes an organic material and a first opening, in which the bump is positioned in the first opening. The moisture-resistant layer entirely covers the protective layer. The moisture-resistant layer includes a second inorganic material and a second opening, in which a portion of the bump is exposed in the second opening.

A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is removed from the first surface and that the first surface is exposed. The wiring substrate has first conductor pads on the first surface, and second conductor pads on the second surface, and the method includes conducting first inspection such that conduction between the second pads is inspected before attaching the second plate to the second surface, and conducting second inspection such that conduction between the first pads is inspected after removing the foil from the first surface.

Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.