An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

A wiring board (3) has first and second rigid sections (11, 12) each having six metal leaf layers, and a flexible section (13) having two metal leaf layers that connect the both rigid sections (11, 12). A capacitor unit (34) and a filter unit 31, which supplies power to an inverter, are mounted on the first rigid section (11), and a CPU (21) and a pre-driver circuit element (22) are mounted on the second rigid section (12). Mutually-independent two control systems are arranged so as to be symmetrical about a board center line (M). Detection signal lines (51) of rotation sensors (37, 38) located at the middle of the first rigid section (11) extend along the board center line (M) on the flexible section (13). Each of the two control systems is configured along a wiring direction of the detection signal lines (51).

A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.

An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

A flexible electronic device (SED) that can conform to a three-dimensional structure, and methods for manufacturing the SED, are disclosed herein. The SED comprises a flexible substrate which is modified in accordance with a folding pattern. The flexible substrate can be folded or unfolded along crease lines of the folding pattern, and the largest deformations of the substrate are localized at the crease lines. Various functional components of the SED are positioned on rigid regions of the substrate defined by the folding pattern. Such that the various functional components are protected from large deformations due to a folding or unfolding process, ensuring good performance of the functional components.

A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.

A curved printed circuit board (PCB) of a computing device is described herein. The computing device includes a housing and a PCB positioned in or on the housing. The computing device also includes a plurality of connectors physically connecting the PCB to a surface of the housing or another surface, such that at least a portion of the PCB is bent.

A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.