A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.

An electronic device is provided. The electronic device includes a first electrical element, a second electrical element, and a rigid flexible printed circuit board electrically connecting the first electrical element and the second electrical element, wherein the rigid flexible printed circuit board includes at least one flexible portion including a first dielectric which has a first dielectric constant and is flexible, at least one rigid portion which extends from the flexible portion and includes a second dielectric which has a second dielectric constant and is less flexible than the first dielectric, a plurality of conductive patterns formed inside the first dielectric and the second dielectric, a plurality of conductive layers formed on the first dielectric and the second dielectric, and a plurality of conductive vias which are formed in the rigid portion and electrically connect the plurality of conductive layers or the plurality of conductive patterns.

Electrical input devices, conductive traces, and microcontroller interface devices can be created in a single print using a multi-material 3D printing process. The devices can include a non-conductive material portion and a conductive material portion. The non-conductive and conductive material portions are integrally formed during a single 3D printing process. For example, a fully functional QWERTY keyboard, ready to receive a microcontroller, can be multi-material 3D printed using the techniques described herein.

An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.

A component carrier with a rigid portion, a flexible portion, a cavity defining the flexible portion next to the rigid portion, and at least one step in a transition portion between the rigid portion and the flexible portion in the cavity is disclosed.

A portable audio input/output device may include one or more openings that extend through a cover of the device and allow acoustic signals outside a housing of the device to reach a microphone disposed within the housing. The opening(s) may be illuminated by a light guide disposed within the housing, which scatters light emitted from lights disposed within the housing. In some instances, a hole may pass through a printed circuit board to allow acoustic signals to be received by the microphone disposed below the printed circuit board. An input/output (I/O) interface module with multiple buttons and inputs may be installed in the hole. The multiple buttons and I/O ports of the I/O interface module may be aligned along an axis vertical relative to the housing and centered with respect to each other.

An inductive component has at least one conductor loop arranged on a printed circuit board and at least one core made of inductive material that cooperates inductively with the conductor loop. The printed circuit board comprises an upper face, a lower face and narrow faces, and moreover at least two printed circuit board parts. Each printed circuit board part has a part of the at least one conductor loop. At least one of the printed circuit board parts comprises a first and a second contact portion. The first contact portion is connected to a first face, in particular the upper face, of the second printed circuit board part and the second contact portion is connected to a second face, in particular the lower face, of the second printed circuit board part, which second face is different from the first face.

A printed circuit board includes a rigid region and a flexible region; a first substrate disposed on the rigid region and the flexible region and comprising a first insulating layer and a first wiring layer comprising a first groove in the flexible region; and a second substrate disposed on the first substrate in the rigid region and comprising a first adhesive layer, a second insulating layer and a second wiring layer.

A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.

For the miniaturization of an investigation instrument (1), which includes a sensor (3), which is arranged in the interior of a long shaft (2) and is electrically contact-connected by a connection (8), it is provided that a flexible bending section (10) is configured on the connection (8), and is thus connected with a contact-connection section (9), which is contact-connected with contacts (4) of the sensor (3) on the reverse side such that, firstly, the entire connection (8) is arranged in the shadow of the image sensor (3) and, secondly, the bending section (10) originates from the contact-connection section (9) within a field (5) which is subtended by the reverse-side contacts (4) of the sensor (3).