An integrated circuit includes a nexus and a first, a second, a third, and a fourth circuit board. Each of the first and second circuit boards is coupled to opposing sides of the nexus, and each of the third and fourth circuit boards is coupled to opposing sides of the second circuit board. The integrated circuit is transitionable between a first, open configuration, in which the first, second, third and fourth circuit boards and the nexus are substantially coplanar, and a second configuration, in which the first, second, third and fourth circuit boards and the nexus are coupled to one another to define a cavity therein.

A bending apparatus including a stage on which a bending object is positioned, a bending bar, a drive unit connected to the bending bar and configured to move the bending bar according to a standard route to bend the bending object by coming into contact with the bending object, and a measuring unit that measures a movement route of the bending bar.

A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.

A flexible wiring board includes a layer including an impedance control line capable of transmitting a high frequency signal and a conductive layer including a conductor positioned along the impedance control line. The flexible wiring board is capable of transmitting high frequency signals well.

The present invention relates to an LED filament lamp (10) comprising a two-dimensional flexible printed circuit board (100), PCB, having a first and a second opposing connection end portions (110, 120). The two-dimensional flexible PCB (100) comprises a plurality of filaments lines (130a-d) extending from the first connection end portion (110) to the second connection end portion (120), wherein each filament line (130a) comprises an array of LEDs (130.sub.a1-130.sub.aN). The two-dimensional flexible PCB (100) is arranged in a cylinder shape by connecting the first and the second opposing connection end portions (110, 120) such that each (130a) of the plurality of filament lines (130a-d) is connected to another (130b) one of the plurality of filament lines (130a-d) thereby a spiral LED filament (150) is formed by the plurality of filament lines (130a-d).

An opto-electronic module is configured to fit between anterior and posterior surfaces of a contact lens. The opto-electronics module may comprise a plurality of light sources configured to direct a plurality of light beams to a region of the retina away from the fovea and in some embodiments away from the macula. Each of the plurality of light sources may comprises an LED and one or more projection optics. Each of the projection optics can be coupled to an LED with an adhesive prior to placing the opto-electronics module on a layer of contact lens material. The opto-electronics module may comprise a flex PCB with the plurality of light sources, an antenna, a battery, a capacitor and a processor supported on the flex PCB.

A wiring assembly includes a first circuit board, a second circuit board separate from the first circuit board, the second circuit board including a peripheral portion that annularly partially surrounds a periphery of the first circuit board, a first connection portion that connects the first circuit board and the peripheral portion, and a second connection portion that connects the first circuit board and the peripheral portion. The peripheral portion and a portion of the first circuit board between a portion connected to the first connection portion and a portion connected to the second connection portion are annular.

A bus bar module includes a circuit body, a bus bar, a holder, and a cover configured to be assembled to the holder to protect the circuit body and the holder. The circuit body includes a belt-like main line that extends in a first direction, a belt-like branch line that extends from the main line so as to branch from the main line, and a connection portion provided in a position closer to a distal end of the branch line than a folded portion the branch line. The cover is structured so as to be stretchable and shrinkable in the first direction in accordance with a stretching and a shrinking of the holder in the first direction.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.