A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

An electronic circuit module includes: a substrate on which a wiring pattern having an electrode portion is formed; a cable having an external insulator and a conductor portion, at least a distal end side of the external insulator being removed to expose a conductor, an exposed portion of the conductor being defined as the conductor portion; and an electronic component having terminals at least on two opposed faces of the electronic component. At least one of the terminals of the electronic component is directly connected to the conductor portion, and is configured to be electrically connected to the electrode portion through the conductor portion.

A connection FPC 75 includes a plurality of metal wires 750 between a support layer 751 and a covering layer 752, and an exposed region including contacts 753 serving as end portions of the metal wires 750 is exposed from the covering layer 752. A bending-position guide 760 is provided on the surface of the support layer 751 opposite from the surface on which the metal wires 750 are provided. An edge 760a of the bending-position guide 760 serves as a bending line along which the connection FPC 75 is bent and is disposed in a covering-layer projection area E where the covering layer 752 is projected on the support layer 751. The connection FPC 75 is bent at portions of the metal wires 750 covered with the covering layer 752, that is, at reinforced portions.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

A flexible display device and an electronic device, applied to the technical field of display, are provided and aim at solving the technical problem in the related art that a driving IC is prone to rupture and/or breakage following bending of a flexible display panel. The flexible display device may include a flexible display panel, a flexible circuit board, and a driving IC. The flexible circuit board may include a body portion including an element arrangement region and a reserved region, and a connecting portion protruding from the reserved region and extending toward the flexible display panel, and is connected to the flexible display panel. A separation space is defined among the body portion, the connecting portion, and the flexible display panel. The driving IC is electrically installed in the element arrangement region.

The description relates to display devices. One example can include an integrative display chassis defining a major planar surface and having a feature formed relative to the major planar surface. The example can also include a display positioned relative to the integrative display chassis and extending along the major planar surface defined by the integrative display chassis. The example can further include an electronic component positioned in the feature and oriented relative to the major planar surface by the feature.

The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

A rollable display device includes a rollable structure including a plurality of unit structures, a display panel structure attached to the rollable structure, and a plurality of magnetic objects on a bezel region of the rollable structure, wherein respective widths of the unit structures increase in a direction from a first side of the rollable structure to a second side of the rollable structure, wherein the unit structures collectively form first through (n)th rolling cycles, as the rollable structure is rolled, and a (k)th rolling cycle encircles a (k−1)th rolling cycle, and wherein the plurality of magnetic objects aligns the (k)th rolling cycle with the (k−1)th rolling cycle by causing a magnetic attraction between the (k)th rolling cycle and the (k−1)th rolling cycle.