A display apparatus includes a flexible circuit board including a plurality of first substrate pads and a plurality of second substrate pads, a main circuit board connected to the flexible circuit board, and a display panel including a plurality of first display pads and a plurality of second display pads, where the plurality of first display pads is connected to the main circuit board through the flexible circuit board and each of the plurality of first display pads at least partially overlaps corresponding substrate pad of the plurality of first substrate pads, respectively, and each of the plurality of second display pads at least partially overlaps corresponding substrate pad of the plurality of second substrate pads, respectively.

An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.

A case includes a movable body to which an optical module having a first flexible wiring board is to be attached, a fixed body, and a second flexible wiring board with which the first flexible wiring board is to be connected. The movable body is swingably held by the fixed body, and the second flexible wiring board is structured to be resiliently bent easier than the first flexible wiring board.

Apparatus and method for transferring data in a data storage system, such as but not limited to a hard disc drive (HDD). An optical link is provided between an analog front end (AFE) of a data storage device controller circuit (SOC) and a preamplifier/driver circuit (preamp) mounted to a rotary actuator to transfer an analog domain signal. A selected component is extracted from the signal using a modulation element such as a micro-resonance ring (MRR) or a Mach-Zehnder Interferometer Modulation (MZM) device. The extracted component is forwarded to a processing circuit to facilitate a transfer of data between a local memory and a non-volatile memory (NVM). The optical link includes a flexible portion in a flex circuit affixed to the rotary actuator and which supports the preamp. Multiplexed read, write, and power control signals are concurrently transmitted via the optical link. The link can concurrently service multiple head-disc assemblies (HDAs).

An electronic device includes: a first housing including a first printed circuit board (PCB) and a second housing including a second printed circuit board (PCB), a flexible display, and a flexible printed circuit board (FPCB) including a first portion, a second portion connected to the first portion and the first PCB and configured to bend relative to the first portion in a first bending direction, a first flexible portion between the first portion and the second portion, a third portion connected to the first portion and the second PCB and configured to bend relative to the first portion in a second bending direction opposite to the first bending direction, and a second flexible portion between the first portion and the third portion.

A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a substrate, forming an electric circuit layer on the substrate at an elevated temperature, forming an opening in the transparent region and penetrating through a portion of the electric circuit layer, forming a light emitting unit on the electric circuit layer in the first region, and forming an insulating layer on the substrate. At least a part of the insulating layer is formed in the opening.

A wireless communication device includes a base sheet in a folded state, a first conductor pattern disposed on a first principal surface of the base sheet, a second conductor pattern disposed on a second principal surface of the base sheet opposite to the first principal surface, an RFIC chip disposed on the base sheet so as to electrically connect to the first conductor pattern, and a sheet-shaped connection conductor coupled to a turning part of the base sheet so as to partially overlap with an end portion of the first conductor pattern near the turning part and an end portion of the second conductor pattern near the turning part.

The present disclosure provides a foldable support, and a display device. The foldable support includes at least two metal layers, where at least one of the at least two metal layers is provided with a plurality of recessed portions at the at least one bending region; and a buffer structure located at at least one of the following positions: a position between two adjacent metal layers and a position in a plurality of the recessed portions of the at least one of the at least two metal layers.

A flexible circuit board includes a plurality of first wires that have a first connection area and a first insulating layer that covers the first wires such that the first connection area is exposed. A printed circuit board includes a plurality of second wires that have a second connection area, a second insulating layer that covers the second wires such that the second connection area is exposed, and a plurality of island conductors adjacent to the second wires across a gap. The second connection area is covered with an anisotropic conductive layer. Each of the second wires in the second connection area at least partially faces a corresponding one of the first wires in the first connection area across the anisotropic conductive layer. The plurality of island conductors include an island conductor that is in contact with the anisotropic conductive layer and partially exposed from the anisotropic conductive layer.

The flexible circuit board includes: a substrate layer; a first conductive layer; a second conductive layer; a first cover film, a second cover film, a first electromagnetic shielding layer, and a second electromagnetic shielding layer. The part of the first cover film overlapping a first conductive portion has first hollow portions. The part of the second cover film overlapping a second conductive portion has second hollow portions. The orthographic projection of each first hollow portion on the substrate layer has an overlapping area with the orthographic projection of at least one second hollow portion on the substrate layer. The first electromagnetic shielding layer is coupled to the first conductive portion through the first hollow portions. The second electromagnetic shielding layer is coupled to the second conductive portion through the second hollow portions.