A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa.

Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

According to one embodiment, a flexible substrate includes a first protective member including a first surface, a line portion including a flexible insulating base located on the first surface and a wiring layer disposed on the insulating base and a second protective member covering the line portion, and the first protective member includes a valley portion and a peak portion in the first surface, and the line portion is formed in a wavy shape and located on the valley portion and the peak portion.

A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.

The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Embodiments described herein relate generally to wearable electronic biosensing garments. In some embodiments, an apparatus comprises a biosensing garment and a plurality of electrical connectors that are mechanically fastened to the biosensing garment. A plurality of printed electrodes is disposed on the biosensing garment, each being electrically coupled, via a corresponding conductive pathway, to a corresponding one of the plurality of electrical connectors. The apparatus can further include an elongate member including a conductive member that is coupled to a plurality of elastic members in a curved pattern and that is configured to change from a first configuration to a second configuration as the elongate member stretches. The change from the first configuration to the second configuration can result in a change of inductance of the conductive member.

There is provided a method of forming a thin film-based microfluidic electronic device. The method includes: providing a first elastomeric thin film layer on a substrate; depositing a first elastomer on the first elastomeric thin film by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer; providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel; providing a sacrificial layer on the second elastomeric thin film; depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel; and electrically connecting the conductor to an electronic component. The thin film-based microfluidic electronic device is a tissue or skin adhesive sensor including a skin adhesive acoustic device.

Wearable ergonomics improvement systems and related methods are disclosed. An example ergonomics improvement system includes a membrane including a first frame having a plurality of first cutouts defining a first pattern. The system includes a sensor coupled to the membrane and includes a second frame having a plurality of second cutouts defining a second pattern. The first pattern is complementary to the second pattern.

This application relates to a method and apparatus formed using the method. The method includes using a first process to form at least one conductive trace on a flexible surface and using a second process to form at least one bead of fluid conductive material at a first location. The method also includes positioning at least one printed circuit board overlaying conductive trace such that the at least one bead of fluid conductive material is aligned with at least one hole in the printed circuit board and pushing the printed circuit board towards the flexible surface. The pushing of the printed circuit board toward the flexible surface forces the bead of fluid conductive material through the hole to form an electrical connection between the at least one conductive trace and an upper surface of the printed circuit board.

A conductive transfer for application to a surface of a wearable item comprises a first non-conductive ink layer and a second non-conductive ink layer. An electrically conductive layer is positioned between the first non-conductive ink layer and the second non-conductive ink layer. The conductive transfer also comprises an adhesive layer for adhering the conductive transfer to the surface of the wearable item. The adhesive layer comprises a larger cross-sectional area than the cross-sectional area of each of the first non-conductive ink layer, the second non-conductive ink layer and the electrically conductive layer.