Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.

Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

A device for manufacturing a stretchable substrate structure according to an embodiment includes a carrier substrate receiving portion configured to receive a carrier substrate therein, a stretchable substrate receiving portion configured to receive a stretchable substrate in a direction facing the carrier substrate, and a diaphragm configured to be deformed by air pressure provided on one surface, wherein the diaphragm comes in contact with an entire surface of the stretchable substrate in a plane direction when deformed, such that the stretchable substrate is combined to the carrier substrate by deforming according to the deformed shape of the diaphragm.

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

A flexible electronic device (SED) that can conform to a three-dimensional structure, and methods for manufacturing the SED, are disclosed herein. The SED comprises a flexible substrate which is modified in accordance with a folding pattern. The flexible substrate can be folded or unfolded along crease lines of the folding pattern, and the largest deformations of the substrate are localized at the crease lines. Various functional components of the SED are positioned on rigid regions of the substrate defined by the folding pattern. Such that the various functional components are protected from large deformations due to a folding or unfolding process, ensuring good performance of the functional components.

Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes coating a first side of a flexible wound contact layer of the wound dressing with a hydrophobic coating. The first side of the wound contact layer can support a plurality of electronic components. The method can further include coating a second side of the wound contact layer opposite the first side with the hydrophobic coating. The wound contact layer can be formed at least partially from hydrophilic material.

There is provided a method for manufacturing a component interconnect board (150) comprising a conductor structure for providing electrical circuitry to at least one component (114) when mounted on the component board, the method comprising providing a conductor sheet (100) with a first predetermined pattern (115), providing a solder resist sheet (112) with a second predetermined pattern for defining solder areas (125) of the component board, forming a subassembly (120) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (130). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

Disclosed is a flexible and stretchable electronic device based on a biocompatible film. The biocompatible film is utilized as an encapsulation layer and a substrate layer of the device; a bonding layer is provided between the encapsulation layer and a functional layer; and an adhesion layer is arranged under the substrate layer. The functional layer employs a flexible and stretchable structure. Solution-based transfer printing technology is primarily used during the preparation of such a device to achieve integration of the functional layer and the flexible substrate layer. This device retains and even enhances the flexibility and stretchability structurally. Meanwhile, the biocompatibility properties thereof, such as being waterproof and air permeable, hypoallergenic, etc., allow it to work normally on the human body surface for more than 24 hours without foreign body sensation and discomfort, and thus, skin maceration, redness or other allergic reactions due to poor biocompatibility can be avoided.

One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.