A semiconductor substrate according to the present disclosure includes a high-frequency circuit, in which a size of each of dummy metal pieces and an interval of an arrangement of the dummy metal pieces constituting a dummy metal piece group in a first area which is inside a line constituting a high-frequency circuit is n times larger than that of a dummy metal piece group outside a peripheral area of the high-frequency circuit; and the number of the dummy metal pieces in the first area is 1/n.sup.2 of the number of the dummy metal pieces outside the peripheral area, where n is a real number greater than one.

An elastically-deformable, conductive composite using elastomers and conductive fibers and simple fabrication procedures is provided. Conductive elastomeric composites offer low resistance to electrical current and are elastic over large (>25%) extensional strains. They can be easily interfaced/built into structures fabricated from elastomeric polymers.

A method for forming a functional layer includes giving information to the functional layer while forming the functional layer on a surface of an object. The functional layer includes an information area having the information and a non-information area other than the information area. The information area is different in color from the non-information area.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

There is provided a semiconductor apparatus including a first high-speed communication controller and a second high-speed communication controller that perform high-speed communication; a first high-speed communication terminal group that includes a first high-speed communication terminal for inputting a first signal; a second high-speed communication terminal group that includes a second high-speed communication terminal for inputting a second signal; and a terminal mounting surface, in which the terminal mounting surface includes a first side and a second side, a shortest distance from the first high-speed communication terminal group to the first side is shorter than a shortest distance from the second high-speed communication terminal group to the first side, and a shortest distance from the second high-speed communication terminal group to the second side is shorter than a shortest distance from the first high-speed communication terminal group to the second side.

A light distribution method is for an adaptive driving beam headlamp system including a light emitting device, an on-board camera and an electronic control unit. The light distribution method includes: obtaining data indicative of a state in front of a vehicle by the on-board camera; computing one or more of: attributes of an object in front of the vehicle; attributes of a vehicle ahead; a speed of the vehicle ahead; a distance between vehicles; brightness of the object; and a road shape; determining a light distribution pattern; determining a control amount indicative of at least one of an ON or OFF state of each of the light emitting elements and an applied power to each of the light emitting elements according to the light distribution pattern determined; and controlling driving of the adaptive driving beam headlamp system based on the control amount determined.

There is provided a smart package and monitoring system having a status indicator and a method of making the same. The smart package includes an electronic sensor monitoring tag having re-usable electronic circuitry and power source along with a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device. The conductive grid is aligned with an opening of the smart package. The smart package can also include an optical ink indicator configured to display the status of the package. A multiplexer can be used to connect the tag to the conductive grid. The conductive grid can include capacitive sensors formed on a thin plastic layer and positioned so as to form a capacitive element with the conductive side of the blister.

A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.

An apparatus simulates cable routing for determining signal integrity between electronic components within a computer chassis. The apparatus includes a base plate simulating a computer chassis base. The base plate includes a top surface. The apparatus further includes a plurality of reconfigurable mounting fixtures, each allowing temporary mounting of a printed circuit board assembly (PCBA) to a respective reconfigurable mounting fixture. Each of the plurality of reconfigurable mounting fixtures is temporarily mountable anywhere on the top surface of the base plate. The apparatus further includes a cable having a first end connector that allows a connection to a first PCBA, and a second end connector that allows a connection to a second PCBA.