A microcapsule includes a shell including a conducting component; and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have a conducting state with the other capsule.

One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.

A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.

A plug-in module circuit board includes a plurality of plug-in modules attached to each other side-by-side in a lateral longitudinal row. Each of the plurality of plug-in-modules has an electrical contact and each of the electrical contact housings has at least one outer surface with a latching structure, a pair of upper guide bores a pair of electrical contacts ad pair of locking devices in the pair of upper guide bores, and a common electrical voltage connection in communication with each of the electrical contacts such that each of the electrical contacts has a common electrical voltage provided thereto. One connecting leg of a light emitting diode (LED) is locked in one electrical contact housing and another connecting leg of the LED is locked in an adjacent electrical contact housing such that each leg of the LED has a different polarity voltage applied thereto.

The present invention relates generally to electric circuit testing, building, or implementing using a breadboard-style printed circuit board (PCB). Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In one or more embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points may be built. In one or more embodiments, an embedded wire and solder bridge is capable of connecting a column of signal tie points, and/or an embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit may be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wire.

A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a substrate. The electronic device package can also include an electronic component disposed on the substrate and electrically coupled to the substrate. The electronic device package can further include a connector disposed on the substrate and electrically coupled to the substrate for communication with the electronic component. The connector can have a contact to interface with a mating connector and configured to provide a signal and/or power to the electronic component to facilitate testing the electronic component. Additionally, the electronic component can include an encapsulant material disposed on the substrate and at least partially encapsulating the electronic component and/or the connector. The contact can be accessible on a top side of the electronic device package to facilitate coupling the connector to a testing device. Associated systems and methods are also disclosed.

The object of the invention is to provide a plug-in module System for constructing different plug-in module circuit boards from couplable plug-in modules for light-emitting diodes which are to be plugged onto the circuit board top side for example. The plug-in modules can be connected to the housing outer sides for forming the circuit boards from longitudinal circuit board rows by means of lateral longitudinal recesses and grid ribs, wherein, in each case one upper guide bore with an electrical voltage contact-making means, for example for a common plug-in diode bridge, is applied to the top sides of two adjacent plug-in modules in a laterally adjacent manner, and for forming additional perpendicular circuit board rows in each case contact-making means and plug-in connections of the contacts of the circuit board longitudinal rows on the front side with a projecting end section of a contact spring strip with corresponding contact-making means of the plug-in modules of the perpendicular circuit board rows, further on their housing rear sides an opening housing outlet with openings of the guide bores for mating the contact spring strips with the contact spring end section of the rear plug-in module. The plug modules therefore have two guide bores with a contact spring strip which widens from the top side to the front side over two contacts, a common wide front opening of the guide bores and a latching structure on the outer sides. Furthermore, latching and plug-in sections for contact spring strips which are situated one behind the other on the housing rear sides when mating in perpendicular longitudinal circuit board rows as conductor strips for voltage connection.

The invention provides a 3D printing method and product which makes use of a base module which comprises an electrical circuit, wherein the electrical circuit is incomplete. A 3D printed structure over the module completes the electrical circuit of the base module.

The present invention relates generally to electric circuit testing, building, or implementing using a breadboard style PCB. Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points. In embodiments, the embedded wire and solder bridge is capable of connecting a column of signal tie points. In embodiments, the embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit can be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wires.