A method includes providing a radio frequency front end (RFFE) switch including a single pole input terminal and a number (N) of output terminals. Each of the N output terminals is a component of a respective one of N throws of the RFFE switch, with N being greater than one. The N output terminals include a first output terminal corresponding to a first throw of the N throws and at least one additional output terminal not connected to any radio frequency (RF) band path. The at least one additional output terminal includes a second output terminal corresponding to a second throw of the N throws. The method includes connecting the first output terminal to a single RF band path. The method includes forming a parallel connection between the single pole input terminal and the single RF band path. The parallel connection provides at least two parallel branches for routing RF signals being transceived between the single pole input terminal and the single RF band path.

A cable harness supplies a plurality of electric devices which are in a distributed arrangement in a device housing. A first connection point of the cable harness has a plug connector on the side of the cable harness. At least the electric devices which are supplied via the first connection point are connected to the first plug connector on the side of the cable harness by way of a device-side plug connector and an adapter that is plugged together with both plug connectors.

Embodiments describing an approach to detecting negative paths for a circuit design based on a circuit timing test of the circuit design. Assigning each negative path to a logic bucket, an integration bucket, or a macro bucket, wherein the logic bucket corresponds to logic design flaws, the integration bucket corresponds to integration design flaws, and the macro bucket corresponds to macro design flaws or design flaws residing within a macro of the circuit design. Detecting a modification to the circuit design based on the logic design flaws, the integration design flaws, and the macro design flaws, and applying the modification to the circuit design to enable manufacturing an integrated circuit, wherein an overall delay between two latches of the integrated circuit is below a predetermined threshold.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

Disclosed in various examples of the present application is an electronic device comprising: first and second conductive patterns electrically connected to a communication circuit; a conductive material electrically connected between the first and second conductive patterns; a third conductive pattern spaced apart in a first direction from the first and/or second conductive patterns; and a fourth conductive pattern spaced apart in a second direction opposite to the first direction from the first and/or second conductive patterns, wherein each of the first and second conductive patterns comprises a first part of a first width and a second part of a second width wider than the first width, and the conductive material is arranged on at least a portion of the second part of the first conductive pattern and the second part of the second conductive pattern.

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

A mass produced electrically conductive device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.

A circuit board for an image forming apparatuses to which a first integrated circuit or a second integrated circuit is provided, comprising an electric part provided to a first surface of the circuit board, a first attachment part provided to the first surface, to which at least one terminal of the first integrated circuit is attachable, a first conductor pattern formed on the first surface and configured to constitute at least a portion of a first wiring which connects the first attachment part and the electric part, a second attachment part provided to a second surface opposite to the first surface of the circuit board, to which at least one terminal of the second integrated circuit is attachable.

An electrical circuit can include a circuit board having a first portion and a second portion. The electrical circuit can also include at least one first light source disposed on the first portion. The electrical circuit can further include multiple second light sources disposed on a trimmable section of the second portion. The electrical circuit can also include at least one third light source disposed on a non-trimmable section of the second portion. The trimmable section can be trimmed to form a trimmed circuit board. The trimmed circuit board can have disposed thereon a remainder of the plurality of the second light sources. The at least one first light source, the remainder of the plurality of second light sources, and the at least one third light source can be disposed on the trimmed circuit board in such a way as to provide substantially uniform light.

A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.